Results 21 to 30 of about 135,759 (319)

Reference-free detection of semiconductor assembly defect [PDF]

, 2005
This paper aims at developing a novel defect detection algorithm for the semiconductor assembly process by image analysis of a single captured image, without reference to another image during inspection.
Chung, R, Fung, KSM, Lam, EY, Leung, WH, Ng, ANY   +4 more
core   +1 more source

A Robust 43-GHz VCO in CMOS for OC-768 SONET Applications [PDF]

, 2004
In this paper, we present a 43-GHz LC-VCO in 0.13-/spl mu/m CMOS for use in SONET OC-768 optical networks. A tuned output buffer is used to provide 1.3 V/sub p-p/ (single-ended) into a 90-fF capacitive load as is required when the VCO is used in typical ...
Boccuzzi, Vito, Frye, Robert C., Gierink, Sander L.J., Gierkink, Sander L.J., Nauta, Bram, van der Wel, A.P.   +5 more
core   +6 more sources

Design and Fabrication Technology of Low Profile Tactile Sensor with Digital Interface for Whole Body Robot Skin

Sensors, 2018
Covering a whole surface of a robot with tiny sensors which can measure local pressure and transmit the data through a network is an ideal solution to give an artificial skin to robots to improve a capability of action and safety.
Mitsutoshi Makihata, Masanori Muroyama, Shuji Tanaka, Takahiro Nakayama, Yutaka Nonomura, Masayoshi Esashi   +5 more
doaj   +1 more source

The Demonstration of S²P (Serial-to-Parallel) Converter with Address Allocation Method Using 28 nm CMOS Technology

Applied Sciences, 2021
To improve the performance of analog, RF, and digital integrated circuits, the cutting-edge advanced CMOS technology has been widely utilized. We successfully designed and implemented a high-speed and low-power serial-to-parallel (S2P) converter for 5G ...
Min-Su Kim, Youngoo Yang, Hyungmo Koo, Hansik Oh   +3 more
doaj   +1 more source

(Invited) mm-wave silicon ICs: An opportunity for holistic design [PDF]

, 2008
Millimeter-waves integrated circuits offer a unique opportunity for a holistic design approach encompassing RF, analog, and digital, as well as radiation and electromagnetics.
Hajimiri, Ali
core   +1 more source

Transient thermal transport in a three-dimensional integrated circuit (3D IC) with unequally sized die

International Communications in Heat and Mass Transfer
Vinay Dhakal, Girish Krishnan, Ankur Jain   +2 more
openaire   +2 more sources

VLSI Reliability in Europe [PDF]

, 1993
Several issue's regarding VLSI reliability research in Europe are discussed. Organizations involved in stimulating the activities on reliability by exchanging information or supporting research programs are described.
Verweij, J.F., Verweij, Jan F.
core   +2 more sources

A Low-Noise Interface ASIC for MEMS Disk Resonator Gyroscope

Micromachines, 2023
This paper proposes a low-noise interface application-specific integrated circuit (ASIC) for a microelectromechanical systems (MEMS) disk resonator gyroscope (DRG) which operates in force-to-rebalance (FTR) mode.
Wenbo Zhang, Liang Yin, Yihang Wang, Risheng Lv, Haifeng Zhang, Weiping Chen, Xiaowei Liu, Qiang Fu   +7 more
doaj   +1 more source

Machine Learning Integrated Pseudo-3-D Flow for Monolithic 3-D ICs

IEEE Journal on Exploratory Solid-State Computational Devices and Circuits, 2021
Monolithic 3-D (M3-D) IC design is a manufacturing technique that opens several new possibilities of chip design and exploration for power, performance, area (PPA), and cost benefits.
Sai Pentapati, Bon Woong Ku, Sungkyu Lim
doaj   +1 more source

Characterization of an embedded RF-MEMS switch [PDF]

, 2010
An RF-MEMS capacitive switch for mm-wave integrated circuits, embedded in the BEOL of 0.25μm BiCMOS process, has been characterized. First, a mechanical model based on Finite-Element-Method (FEM) was developed by taking the residual stress of the thin ...
Ehwald, K. E., Gurbuz, Yasar, Gürbüz, Yaşar, Kaynak, Mehmet, Korndorfer, F., Korndörfer, F., Scholz , Rene, Sun, Y. M., Tillack, B., Wipf, C., Zihir, Samet   +10 more
core   +1 more source