A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing [PDF]
IEEE Access, 2022 Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and dependability in an IC.
Lamia Alam, Nasser Kehtarnavaz
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Generating Defective Epoxy Drop Images for Die Attachment in Integrated Circuit Manufacturing via Enhanced Loss Function CycleGAN [PDF]
Sensors, 2023 In integrated circuit manufacturing, defects in epoxy drops for die attachments are required to be identified during production. Modern identification techniques based on vision-based deep neural networks require the availability of a very large number ...
Lamia Alam, Nasser Kehtarnavaz
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Automatic Integrated Circuit Die Positioning in the Scanning Electron Microscope [PDF]
Scanning, 2002 AbstractIn scanning electron microscope (SEM)‐based integrated circuit (IC) failure analysis, there is often a need for manual location of a prespecified failure site in several ICs. Such a procedure is both tedious and time consuming. This paper presents a new vision‐based die positioning system that can automatically locate a specified failure site ...
Tan, H.W., Phang, J.C.H., Thong, J.T.L.
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Differential Temperature Sensors: Review of Applications in the Test and Characterization of Circuits, Usage and Design Methodology [PDF]
Sensors, 2019 Differential temperature sensors can be placed in integrated circuits to extract a signature of the power dissipated by the adjacent circuit blocks built in the same silicon die.
Enrique Barajas +3 more
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BIST Method for Die-Level Process Parameter Variation Monitoring in Analog/Mixed-Signal Integrated Circuits [PDF]
2007 Design, Automation & Test in Europe Conference & Exhibition, 2007 Peer ...
Zjajo, Amir +2 more
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Expert Systems with ApplicationsThe purpose of this research is to demonstrate the feasibility of automating ‘die-polygon-capturing’, an economical yet still labor-intensive technique for circuit extraction during the reverse-engineering of simple integrated circuits. As microchip designs become increasingly diverse with the ongoing trend of using application-specific integrated ...
Quint van der Linden +3 more
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Optics Express, 2018 In this paper we report a single mode InAs/GaAs quantum dot distributed feedback laser at 1.3 μm wavelength heterogeneously integrated on a Si photonics waveguide circuit. Single mode lasing around 1300 nm with a side-mode suppression ratio higher than 40 dB is demonstrated. High temperature operation with continuous wave lasing up to 100°C is obtained.
Sarah Uvin +9 more
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Implementation of the universal asynchronous receiver-transmitter on the programmable logical integrated circuit die [PDF]
Politechnical student journal, 2018 МГТУ им. Н.Э. Баумана +3 more
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Thin and Rectangular Die Bond Pick-Up Mechanism to Reduce Cracking During the Integrated Circuit Assembly Process [PDF]
Advances in Science and Technology Research Journal, 2020 Ahmad Rahman, Nazrul Nayan
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, 2003 Modeling and simulation are critical to transfer CMP from an engineering 'art' to an engineering 'science'. Research efforts in CMP modeling have been attempted in the last decade. There is an urgent need to review the current models including their limitations and future research directions systematically.
Luo, Jianfeng, Dornfeld, David A
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