Results 41 to 50 of about 135,759 (319)
Validation by Measurements of a IC Modeling Approach for SiP Applications [PDF]
, 2011 The growing importance of signal integrity (SI) analysis in integrated circuits (ICs), revealed by modern systemin-package methods, is demanding for new models for the IC sub-systems which are both accurate, efficient and extractable by simple ...
Canavero, Flavio +8 more
core +1 more source
GaSb-based integrated lasers and photodetectors on a silicon-on-insulator waveguide circuit for sensing applications in the shortwave infrared [PDF]
, 2012 We report our results on GaSb photodiodes and lasers integrated on a Silicon-On-Insulator waveguide circuit. The photodiodes operate at room temperature with 0.4A/W responsivity for grating-assisted coupling and >1 A/W for an evanescent design.
Cerutti, L +5 more
core +1 more source
Micromachines, 2021 Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant.
Seonho Seok
doaj +1 more source
A Fully Differential CMOS Potentiostat [PDF]
, 2009 A CMOS potentiostat for chemical sensing in a noisy environment is presented. The potentiostat measures bidirectional electrochemical redox currents proportional to the concentration of a chemical down to pico-ampere range.
Genov, Roman, Nazari, Meisam Honarvar
core +1 more source
IMPLEMENTATION OF CONFIGURABLE RING OSCILLATOR PUF WITH SYMMETRICAL PATHS ON FPGA
Безопасность информационных технологийThis paper proposes a novel Physical Unclonable Function (PUF) scheme based on a configurable ring oscillator. The circuit utilizes the measurement of signal propagation delay differences along symmetric paths constructed using the internal resources of ...
Alexander A. Ivaniuk, Ksena I. Trubach
doaj +1 more source
Micromachines, 2018 Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer.
Shiro Satoh +3 more
doaj +1 more source
An ART1 microchip and its use in multi-ART1 systems [PDF]
, 1997 Recently, a real-time clustering microchip neural engine based on the ART1 architecture has been reported. Such chip is able to cluster 100-b patterns into up to 18 categories at a speed of 1.8 μs per pattern.
Linares Barranco, Bernabé +1 more
core +1 more source
Therapeutic Apheresis and Dialysis, EarlyView.ABSTRACT Introduction Bloodstream infections due to repeated vascular access (VA) puncture and circuit connections remain major concerns in hemodialysis. Therefore, we examined current practices for glove, disinfectant, and personal protective equipment (PPE) use according to VA type in national university hospitals in Japan.
Aiko Yamada +6 more
wiley +1 more source
A 24-GHz, +14.5-dBm fully integrated power amplifier in 0.18-μm CMOS [PDF]
, 2005 A 24-GHz +14.5-dBm fully integrated power amplifier with on-chip 50-[ohm] input and output matching is demonstrated in 0.18-μm CMOS. The use of substrate-shielded coplanar waveguide structures for matching networks results in low passive loss and small ...
Hajimiri, Ali +2 more
core
The newfound relationship between extrachromosomal DNAs and excised signal circles
FEBS Letters, EarlyView.Extrachromosomal DNAs (ecDNAs) contribute to the progression of many human cancers. In addition, circular DNA by‐products of V(D)J recombination, excised signal circles (ESCs), have roles in cancer progression but have largely been overlooked. In this Review, we explore the roles of ecDNAs and ESCs in cancer development, and highlight why these ...
Dylan Casey, Zeqian Gao, Joan Boyes
wiley +1 more source