Results 11 to 20 of about 135,759 (319)
On-die testing can accelerate development of semiconductor devices, but poses certain challenges related to high frequency and high current switching. This paper describes design and development of a tester for double-pulse switching test and measurement
Jozef Kozarik +5 more
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This review paper reports the prerequisites of a monolithic integrated terahertz (THz) technology capable of meeting the network capacity requirements of beyond-5G wireless communications system (WCS). Keeping in mind that the terahertz signal generation
Chhandak Mukherjee +13 more
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A multi-function microelectromechanical system (MEMS) with a three-axis magnetometer (MAG) and three-axis accelerometer (ACC) function was implemented with an application-specific integrated circuit (ASIC)-compatible complementary metal-oxide ...
Chih-Hsuan Lin +2 more
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The impact of process variations on circuit performance has become more critical with the technological scaling, and the increasing level of integration of integrated circuits. The degradation of the performance of the circuit means economic losses.
Zahira Perez-Rivera +2 more
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Integrated quantum optical phase sensor in thin film lithium niobate
The quantum noise of light, attributed to the random arrival time of photons from a coherent light source, fundamentally limits optical phase sensors. An engineered source of squeezed states suppresses this noise and allows phase detection sensitivity ...
Hubert S. Stokowski +8 more
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The Future of High Frequency Circuit Design [PDF]
The cut-off wavelengths of integrated silicon transistors have exceeded the die sizes of the chips being fabricated with them. Combined with the ability to integrate billions of transistors on the same die, this size-wavelength cross-over has produced
Hajimiri, Ali
core +1 more source
Integrating Metal-Oxide-Decorated CNT Networks with a CMOS Readout in a Gas Sensor
We have implemented a tin-oxide-decorated carbon nanotube (CNT) network gas sensor system on a single die. We have also demonstrated the deposition of metallic tin on the CNT network, its subsequent oxidation in air, and the improvement of the lifetime ...
Suhwan Kim +7 more
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Embedded 5V-to-3.3V Voltage Regulator for Supplying Digital ICs in 3.3V CMOS Technology [PDF]
A fully integrated 5 V-to-3.3 V supply voltage regulator for application in digital IC's has been designed in a 3.3 V 0.5 μm CMOS process. The regulator is able to deliver peak current transients of 300 mA, while the output voltage remains within a ...
Besten, Gerrit W. den, Nauta, Bram
core +2 more sources
Number Determination of Successfully Packaged Dies Per Wafer Based on Machine Vision
Packaging the integrated circuit (IC) chip is a necessary step in the manufacturing process of IC products. In general, wafers with the same size and process should have a fixed number of packaged dies.
Hsuan-Ting Chang +2 more
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Wireless sensor network (WSN) applications are under extensive research and development due to the need to interconnect devices with each other. To reduce latency while keeping very low power consumption, the implementation of a wake-up receiver (WuR) is
David Galante-Sempere +3 more
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