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Advanced Engineering Materials, Volume 27, Issue 6, March 2025.ErB4 and NdB4 nanostructured powders are produced by mechanochemical synthesis. 5 h mechanical alloying and 4 M HCl acid leaching are used in the production. ErB4 and NdB4 powders exhibit maximum magnetization of 0.4726 emu g−1 accompanied with an antiferromagnetic‐to‐paramagnetic phase transition at about TN = 18 K and 0.132 emu g−1 with a maximum at ...
Burçak Boztemur +5 more
wiley +1 more source
A Review on Conduction Mechanisms in Dielectric Films
Advances in Materials Science and Engineering, 2014 The conduction mechanisms in dielectric films are crucial to the successful applications of dielectric materials. There are two types of conduction mechanisms in dielectric films, that is, electrode-limited conduction mechanism and bulk-limited ...
Fu-Chien Chiu
doaj +1 more source
, 2006 The dielectric permittivity and resistivity have been measured simultaneously as a function of magnetic field in Pr1-xCaxMnO3 crystals with different doping. A huge increase of dielectric permittivity was detected near percolation threshold.
Aebischer +42 more
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Dielectric properties of nanosized ZnFe2O4
Processing and Application of Ceramics, 2008 In this paper we present the results concerning the dielectric properties of the nanosized ZnFe2O4. Dielectric permittivity, the loss factor, as well as the conductivity, were measured in the temperature range 300-630 K and at 1 Hz, 10 Hz, 100 Hz, 1 kHz and 10 kHz frequencies.
Cvejić, Željka +4 more
openaire +2 more sources
Harnessing Fungal Biowelding for Constructing Mycelium‐Engineered Materials
Advanced Engineering Materials, EarlyView.Mycelium‐bound composites (MBCs) offer low‐carbon alternatives for construction, yet interfacial bonding remains a critical challenge. This review examines fungal biowelding as a biocompatible adhesive, elucidating mycelium‐mediated interfacial mechanisms and their role in material assembly. Strategies to optimize biowelding are discussed, highlighting
Xue Brenda Bai +2 more
wiley +1 more source
Advances in Electrical and Electronic Engineering, 2017 Polymer properties can be experimentally tailored by adding small amounts of different nanoparticles for enhancing their mechanical, thermal and electrical properties.
Ahmed Thabet, Youssef Mobarak
doaj +1 more source
Materials Research Express, 2021 In order to obtain polyimide composites with ultra-low dielectric constant, a series of MDA-BAPP-BTDA copolyimides/18-crown ether-6 (CPI/18-CE) supramolecular films with inclusion structure were prepared. The effects of 18-CE on CPI’s thermal, mechanical,
Chunguang Xiao +5 more
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Synthesis and applications of low dielectric polyimide
Resources Chemicals and Materials, 2023 With the advent of the 5 G era, advanced packaging applications such as wafer-level fan-out packaging have emerged thanks to efforts to reduce signal loss and increase signal transmission rates.
Yu Liu +5 more
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Packaging of Macroscopic Material Payloads: Needs, Challenges, Concepts, and Future Directions
Advanced Engineering Materials, EarlyView.This review introduces a unified framework that decomposes any macroscopic packaging system into the payload, packaging material, and packaging strategy and combines them into a conceptual packaging equation: packaging strategy = payload + packaging material.
Venkata S. R. Jampani, Manos Anyfantakis
wiley +1 more source
Measuring dielectric properties at the nanoscale using Electrostatic Force Microscopy [PDF]
, 2010 Several electrostatic force microscopy (EFM) - based methods have been recently developed to study the nanoscale dielectric properties of thin insulating layers.
Alegría, Angel +8 more
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