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Thickness-dependent structural evolution of a-C:H layers formed by one-step Ar/CH4 plasma reduction for direct Cu bonding

open access: yesScientific Reports
Direct Cu bonding stands as a pivotal technology for enabling high-density vertical interconnects in advanced 3D heterogeneous integration. However, achieving reliable low-temperature Cu bonding requires a careful balance between suppressing surface ...
Hoogwan Lee, Sarah Eunkyung Kim
doaj   +1 more source

Cellulose-acetate coating of carbon cloth diffusion layer for liquid-fed fuel cell applications. [PDF]

open access: yesJ Power Sources, 2022
Beshai J   +5 more
europepmc   +1 more source

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