Results 41 to 50 of about 48,754,799 (248)
Thermal-Safe Test Scheduling for Core-Based System-on-a-Chip Integrated Circuits
Overheating has been acknowledged as a major problem during the testing of complex system-on-chip (SOC) integrated circuits. Several power-constrained test scheduling solutions have been recently proposed to tackle this problem during system integration.
Rosinger, Paul +2 more
core +1 more source
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe +6 more
wiley +1 more source
Plug & Test at System Level via Testable TLM Primitives [PDF]
With the evolution of Electronic System Level (ESL) design methodologies, we are experiencing an extensive use of Transaction-Level Modeling (TLM). TLM is a high-level approach to modeling digital systems where details of the communication among modules ...
Navabi, Z. +12 more
core +1 more source
Objectives: Adipocyte fatty acid-binding protein (A-FABP) has been implicated in atherosclerosis, and endothelial dysfunction is a critical contributor to cardiovascular outcomes in chronic kidney disease (CKD). This study evaluated links between serum A-
Teoh Ling Lun +6 more
doaj +1 more source
Microstructural evolution of premium rail steel during flash butt welding (FBW), comparing physically simulated heat‐affected zones with actual weld regions. Thermal cycles induce phase transformations and microstructural heterogeneity that influence weld quality and mechanical performance. These findings provide insights into optimizing FBW parameters
Emmanoelle Cintra da Cunha Araújo +15 more
wiley +1 more source
Remote machine condition monitoring based on power supply measurements [PDF]
The most widely used rotating machines in the industry are three phase alternative current (AC) induction machines. With the advances in variable speed drive (VSD) technology, they have become even more reliable than their direct current (DC) counterpart.
Lapa, Raymond
core +2 more sources
Taking the large-scale toppling failure counter-tilted slope in Changshanhao open-pit mine in Inner Mongolia as engineering background, a layered counter-tilted slope geological generalized physical model was constructed based on similar theory. Physical
TAO Zhi-gang +5 more
doaj +1 more source
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein +4 more
wiley +1 more source
Rapid generation of thermal-safe test schedules
Overheating has been acknowledged as a major issue in testing complex SOCs. Several power constrained system-level DFT solutions (power constrained test scheduling) have been recently proposed to tackle this problem.
Rosinger, Paul +5 more
core +1 more source
Hydrostatic rotary tables are key mechatronic components in high-precision manufacturing equipment, and their thermal evolution affects operating stability and machining-related accuracy.
Dongsheng Fu, Wanning Zhu, Hao Zhang
doaj +1 more source

