Results 231 to 240 of about 45,181 (285)
“Dip and Dry” Coating Process Developed for Use of SWNTs in Wearable Electronics [PDF]
, 2010 Steven Trohalaki
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Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.This article demonstrates that encasing a hyperelastic balloon in an inextensible sleeve greatly increases its burst pressure. This simple mechanical behavior can be used to produce an asymmetric inflation‐deflation sequence for coupled balloons with different thicknesses so they could serve as a soft robot's rear and front anchors when driven from a ...
Ifat Gertler, Katherine J. Kuchenbecker
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Enhanced cycle stability of a NiCo2S4 nanostructured electrode for supercapacitors fabricated by the alternate-dip-coating method. [PDF]
R Soc Open Sci, 2018 Kang J, Yim S.
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3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby +5 more
wiley +1 more source
Boronate sol-gel method for one-step fabrication of polyvinyl alcohol hydrogel coatings by simple cast- and dip-coating techniques. [PDF]
RSC Adv, 2019 Nishiyabu R +6 more
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Advanced Materials Technologies, EarlyView.This paper explores integrating organic electrochemical transistors (OECTs) with planarized 3D‐printed substrates, utilizing ironing to enhance surface suitability for printing, dispense printing for thick, low‐resistance silver electrodes, and inkjet printing for semiconductor deposition.
Mohamad Kannan Idris +3 more
wiley +1 more source
Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
Advanced Materials Technologies, EarlyView.This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Synthesis and Characterization of Thin TiO2 Films Using the Sol-gel dip Coating Method
, 2020 R. M. Woo-García +6 more
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Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Advanced Materials Technologies, EarlyView.Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source