Results 171 to 180 of about 68,977 (255)
High‐Resolution Corrosion Fingerprinting of Alloy Libraries via Microdroplet Spectroelectrochemistry
Ionic‐liquid microdroplet spectroelectrochemistry enables stable, localized electrochemical measurements over extended timescales. By coupling impedance spectroscopy, wetting analysis, finite‐element simulations, and operando Raman spectroscopy, it disentangles geometrical and electrochemical effects, opening new opportunities for rapid corrosion ...
Ekaterina Kurchavova +3 more
wiley +1 more source
When myelin breaks, tau aggregates - a new perspective on Alzheimer's disease. [PDF]
Tiane A, van den Hove D, Vanmierlo T.
europepmc +1 more source
Adaptive Foam 3D Printing of Ultralight and Multifunctional Materials
Adaptive foam 3D printing, enabled by expandable microspheres, imparts cellular structures to thermoplastic and thermosetting polymers, manufactured through a variety of processes including fused filament fabrication, direct ink writing, digital light processing, and inkjet printing.
Nariman Rajabifar, Amir Ameli
wiley +1 more source
High abundance of <i>Stenotrophomonas maltophilia</i> in slaty-backed gull breeding in Northern Japan. [PDF]
Kawai M, Fujita R, Ohshima R, Kenzaka T.
europepmc +1 more source
Binder‐free laser powder bed fusion of 8YSZ with a femtosecond laser is used to map process windows linking scan strategy, heat accumulation, and grain growth. Time‐resolved thermography and simulations reveal thermal regimes that enable continuous, vitrified, and fine‐grained 8YSZ surface layers without absorptive additives and demonstrate ...
Markus Kühn +5 more
wiley +1 more source
This article explores the transformative potential of symbolic artificial intelligence (AI) in the field of materials science, particularly in leveraging experimental data. The article presents several symbolic AI models and discusses their applications in materials science.
Ahmed Amrani +7 more
wiley +1 more source
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source
Molecular characterization of pESI-like megaplasmids in <i>Salmonella</i> Infantis from poultry in Lebanon. [PDF]
Barada S +6 more
europepmc +1 more source
Toward Full Interoperability in Materials Science: Integrating Workflows With Knowledge Graphs
The connection of conceptual workflow design, portable execution, and ontology‐based semantics leading to provenance‐rich knowledge graphs are main contributors to interoperability in materials science and a prerequisite to AI‐assisted orchestration and for interoperable Materials Acceleration Platforms.
Jan Janssen +14 more
wiley +1 more source
Virulence gene profiles of extraintestinal pathogenic Escherichia coli (ExPEC) from Zambia: a secondary in silico study. [PDF]
Nyondo FC.
europepmc +1 more source

