Results 231 to 240 of about 166,244,523 (287)

Effect of Cu and CuP Additions on the Microstructure and Nanoindentation‐Based Fracture Behavior of CoNiAlSi Ferromagnetic Shape Memory Alloys

Advanced Engineering Materials, EarlyView.
Cu and combined Cu–P microalloying refine the microstructure and enhance the nanoindentation‐derived fracture resistance of CoNiAlSi ferromagnetic shape memory alloys without suppressing the martensitic transformation. Comparative SEM, DSC, and nanoindentation results reveal that the CuP‐containing alloy provides the most balanced response, achieving ...
Mehmet Demir
wiley   +1 more source

Cryogenic Deformation Behavior of TiAl and Insights Into Embrittlement After High‐Temperature Exposure Combined With Secondary Ion Mass Spectroscopy of Near Surface Chemistry

Advanced Engineering Materials, EarlyView.
Near‐surface deuterium enrichment profiles for different microstructural types of TiAl after exposure at 700 °C in a heavy water‐containing environment. The deuterium levels are significantly higher than expected from natural occurrence, indicating that the heavy water dissociated during the exposure treatment and entered the specimens.
Jonathan D. H. Paul, Alexander Welle, Dirk Matthiessen, Michael Oehring, Fritz Appel, Florian Pyczak   +5 more
wiley   +1 more source

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

Advanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe, Yu Zhou, Shintaro Kamiyama, Takao Okada, Tomohiro Yokozeki, Ryoma Tokonami, Tatsuhiro Takahashi   +6 more
wiley   +1 more source

Rotary 3D Printing With Integrated Electroplating

Advanced Engineering Materials, EarlyView.
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria, Nicola Larovere, Moslem Mohammadi, Gianluca Percoco, Ali Zolfagharian, Gianni Stano   +5 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

Laser‐Induced Graphene from Waste Almond Shells

Advanced Functional Materials, EarlyView.
Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova, Anna Chiara Bressi, Marina Galliani, Attilio Marino, Gianni Ciofani, Eduardo Machado‐Charry, Hilda Gomez Bernal, Alessandra Francini, Luca Sebastiani, Francesco Greco   +9 more
wiley   +1 more source

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Mirrored Arrays for Direction-of-Arrival Estimation

ICASSP 2020 - 2020 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP), 2020
A mirrored array configuration, which consists of an ordinary linear array and a reflector, is proposed. The mirrored arrays can provide composable degrees of freedom (DOF) for array processing by combined measurements with the help of mechanical adjustment (e.g., movement or rotation).
Dong Zhu, Gang Li 0008, Xiao-Ping (Steven) Zhang   +2 more
openaire   +1 more source

Compressive wideband direction of arrival estimation

2015 38th International Conference on Telecommunications and Signal Processing (TSP), 2015
Compressive Sampling (CS) has recently emerged as a groundbreaking technique which reconstructs the sparse signal using samples taken below Nyquist sampling frequency (sub-Nyquist samples). In this paper we consider to estimate the Direction of Arrival (DOA) of wideband signals using sub-Nyquist samples.
Amal Chaturvedi, H. Howard Fan
openaire   +2 more sources

Multiple target direction of arrival tracking

IEEE Transactions on Signal Processing, 1995
A new algorithm is presented for estimating the directions of arrival of signals from an unknown number of moving signal sources. The parameter space is a countable union of Cartesian products of the torus, each product space corresponding to a different number of signals reaching the sensor array. A Bayesian posterior probability measure is defined on
Anuj Srivastava, Michael I. Miller, Ulf Grenander   +2 more
openaire   +2 more sources

The effects of preprocessing on direction of arrival estimation

IEEE International Conference on Acoustics Speech and Signal Processing, 1993
Numerous authors have advocated the use of preprocessing (PP) in high-resolution direction finding algorithms. The optimal PP matrix is identified, in the sense that the accuracy of the direction of arrival estimates are unaffected by the preprocessing step.
Anthony J. Weiss, Benjamin Friedlander
openaire   +2 more sources