Results 171 to 180 of about 321,371 (284)
Probing a CNN-BiLSTM-Attention-Based Approach to Solve Order Remaining Completion Time Prediction in a Manufacturing Workshop. [PDF]
Chen W, Wang L, Liu C, Zhang Z, Tang D.
europepmc +1 more source
Opportunities for Multiscale Pattern Modulation with Temporally Arrested Breath Figures
This works presents the temporally arrested breath figure methodology and its opportunities for pattern modulation. Through thermodynamic and photochemical phase change handles, this method uses drop‐wise condensation as a dynamic template for fast, accessible and scalable micropatterning.
Francis J. Dent +5 more
wiley +1 more source
Curvature-Adoptive CNC Machining of Freeform Optics via Dynamic Tangential Toolpath Optimization. [PDF]
Singh RP, Chen Y.
europepmc +1 more source
Using femtosecond ablation, we show that an ordered, stoichiometric crystalline PdSe2 target can be controllably converted into a stable, disordered, non‐stoichiometric, and highly functional amorphous nanomaterial, PdSe2−x${\rm PdSe}_{2-x}$. The obtained nanoparticles offer significant advantages over conventional planar plasmon‐free substrates due to
Andrei Ushkov +18 more
wiley +1 more source
Inverse Lithography Technology (ILT) Under Chip Manufacture Context. [PDF]
Meng X, Chen C, Ni J.
europepmc +1 more source
This study describes the fabrication of arrays of luminal tissue constructs for 3D luminal tissue modeling. An oil or media‐filled reservoir between constructs serves as a liquid barrier or bridge to regulate communication between lumens within the array for modeling multi‐tissue interactions in vitro. Abstract Cell‐lined luminal structures are crucial
Mouhita Humayun +9 more
wiley +1 more source
Optimization of machine tool processing scheduling based on differential evolution algorithm. [PDF]
Zhang Y, Zhang M.
europepmc +1 more source
This paper explores integrating organic electrochemical transistors (OECTs) with planarized 3D‐printed substrates, utilizing ironing to enhance surface suitability for printing, dispense printing for thick, low‐resistance silver electrodes, and inkjet printing for semiconductor deposition.
Mohamad Kannan Idris +3 more
wiley +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
A multiscale topology optimization design framework with data driven surrogate model. [PDF]
Zhou H, Zhou C.
europepmc +1 more source

