Results 161 to 170 of about 304,144 (298)
Advanced Science, EarlyView.ABSTRACT The multifunctional integration of chips with high flexibility and scalable manufacturing is crucial for enhancing chip performance, reducing chip size, and simplifying chip design. However, balancing volume, cost, flexibility, and functionality using traditional heterogeneous integration methods is challenging.
Lang Chen +7 more
wiley +1 more source
Braze welding of Dissimilar Materials
Biuletyn Instytutu Spawalnictwa, 2018 Zbigniew Mirski +2 more
openaire +2 more sources
Direct bonding dissimilar optical materials
, 2018 This thesis presents the work conducted during this project on direct bonding of dissimilar optical materials at the Optoelectronics Research Centre, University of Southampton. It covers the history and background of the art, before progressing to the development of unique bonding processes used during the research detailed. During this project, direct
openaire +1 more source
Progress in Strain Engineering of 2D‐Integrated Heterostructures for Ultrasensitive Sensors
Advanced Science, EarlyView.. ABSTRACT Two‐dimensional (2D) integrated heterostructures have emerged as a cornerstone in the advancement of next‐generation sensor technologies. These heterostructures, which combine materials with different dimensionalities, have led to significant breakthroughs in sensing performance and device integration.
That Buu Ton +4 more
wiley +1 more source
Improved Direct Ink Writing of Liquid Metal Foams via Liquid Additives
Advanced Electronic Materials, EarlyView.The ability to pattern liquid metal is useful for making soft electrical and thermal devices. Dispensing liquid metal from a nozzle naturally results in the formation of spheroidal droplets, making direct‐write printing challenging. Liquid metal foams containing pockets of air can extrude as filaments, albeit inconsistently.
Febby Krisnadi +3 more
wiley +1 more source
Optimizing Mechanical Structures Through Butt Joining of Dissimilar Materials for Lightweight Components. [PDF]
Materials (Basel)Szusta J +3 more
europepmc +1 more source
Uranium Doped Gallium Nitride Epitaxial Thin Films
Advanced Electronic Materials, EarlyView.Uranium was controllably added to gallium nitride using molecular beam epitaxy. The uranium atoms segregated into vertically oriented regions with higher doping levels. Concentrations up to a few percent were achieved without showing significant degradation in the crystalline quality or optical characteristics. Low electrical resistivity was maintained
J. Pierce Fix +10 more
wiley +1 more source
The Laser Welding Research of Dissimilar Materials Between AlCoCrFeNi2.1 Eutectic High-Entropy Alloy and GH3030 Nickel-Based Alloy. [PDF]
Materials (Basel)Liu A +5 more
europepmc +1 more source
Chronic Disease Monitoring Using Advanced Compliant Materials for Bioelectronics
Advanced Electronic Materials, EarlyView.Compliant bioelectronic systems enable continuous monitoring of chronic disease through soft, stretchable materials and tissue‐conformal designs that support stable electrophysiological, mechanical, and biochemical sensing. Integration of diverse sensing modalities with thoughtful material selection, device architectures, and advanced fabrication ...
Han Kim +7 more
wiley +1 more source
Extrinsic-Riveting Friction Stir Lap Welding of Al/Steel Dissimilar Materials. [PDF]
Materials (Basel)Meng X +7 more
europepmc +1 more source