Results 81 to 90 of about 322,612 (279)
Packaging of Macroscopic Material Payloads: Needs, Challenges, Concepts, and Future Directions
This review introduces a unified framework that decomposes any macroscopic packaging system into the payload, packaging material, and packaging strategy and combines them into a conceptual packaging equation: packaging strategy = payload + packaging material.
Venkata S. R. Jampani, Manos Anyfantakis
wiley +1 more source
Assessing Altered Coating Adhesion on Plasma‐Deoxidized Surfaces Under Oxygen‐Free Conditions
This study demonstrates the effectiveness of atmospheric pressure plasma pretreatment in modifying silicon and stainless steel surfaces to improve adhesion. Argon‐hydrogen plasma increases surface roughness and improves adhesion strength, whereas pure argon results in smoother surfaces and structural changes.
Selina Raumel +6 more
wiley +1 more source
The resistance distance is widely used in random walk, electronic engineering, and complex networks. One of the main topics in the study of the resistance distance is the computation problem.
Qun Liu, Jia-Bao Liu, Shaohui Wang
doaj +1 more source
Copper‐based composites enhanced with carbon feature convenient mechanical properties and favorable electric conductivity. Processing via deformation and thermomechanical treatments can introduce advantageous microstructures further enhancing their performance. Herein, copper–graphene powder‐based composites are directly consolidated via rotary swaging
Radim Kocich +3 more
wiley +1 more source
Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad +6 more
wiley +1 more source
A novel workflow for investigating hydride vapor phase epitaxy for GaN bulk crystal growth is proposed. It combines Design of experiments (DoE) with physical simulations of mass transport and crystal growth kinetics, serving as an intermediate step between DoE and experiments.
J. Tomkovič +7 more
wiley +1 more source
On the distance eigenvalues of Cayley graphs
In this paper, graphs are undirected and loop-free and groups are finite. By Cn, Kn and Km,n we mean the cycle graph with n vertices, the complete graph with n vertices and the complete bipartite graph with parts size m and n, respectively.
Majid Arezoomand
doaj
Biofabrication aims at providing innovative technologies and tools for the fabrication of tissue‐like constructs for tissue engineering and regenerative medicine applications. By integrating multiple biofabrication technologies, such as 3D (bio) printing with fiber fabrication methods, it would be more realistic to reconstruct native tissue's ...
Waseem Kitana +2 more
wiley +1 more source
This study presents novel anti‐counterfeiting tags with multilevel security features that utilize additional disguise features. They combine luminescent nanosized Ln‐MOFs with conductive polymers to multifunctional mixed‐matrix membranes and powder composites. The materials exhibit visible/NIR emission and matrix‐based conductivity even as black bodies.
Moritz Maxeiner +9 more
wiley +1 more source
A Relation between D-Index and Wiener Index for r-Regular Graphs
For any two distinct vertices u and v in a connected graph G, let lPu,v=lP be the length of u−v path P and the D–distance between u and v of G is defined as: dDu,v=minplP+∑∀y∈VPdeg y, where the minimum is taken over all u−v paths P and the sum is taken ...
Ahmed Mohammed Ali, Asmaa Salah Aziz
doaj +1 more source

