Results 201 to 210 of about 72,779 (234)

Treatment discontinuation of remotely delivered cognitive remediation for schizophrenia: a systematic review and meta-analysis. [PDF]

Front Psychiatry
Wen M, Zhang J, Jiang K, Liu J, Zhu X.
europepmc   +1 more source

Prompt-mamba filtering networks for accurate hepatocellular carcinoma lesion segmentation in abdominal CT. [PDF]

NPJ Digit Med
Xia L, Chen HY, Cao YW, Gan CQ, Zhao JZ, Zheng WH, Jia H, Jiang S, Li X, Li H, Tu YN, Zhang JJ.   +11 more
europepmc   +1 more source

Dynamic Population Distribution and Perceived Impact Area of the Tibet Dingri M_S6.8 Earthquake Based on Mobile Phone Location Data. [PDF]

Sensors (Basel)
Li H, Xia C, Zhang Y, Chen Y, Qi W, Yang F, Wang X.   +6 more
europepmc   +1 more source

Fair charging management of PHEVs in radial distribution networks with DG resources-a case study. [PDF]

Sci Rep
Yazdanpanah F, Kiani MJ, Zadehbagheri M, Mohammadi S.   +3 more
europepmc   +1 more source

Design of an iterative sequential physics-guided and causality-aware ultrasound video framework for robust liver fibrosis classifications. [PDF]

MethodsX
Gadare NT, Rode SV.
europepmc   +1 more source

Design and numerical analysis of a gap-compensated low loss hollow-core antiresonant fiber with nested elliptical tubes. [PDF]

Sci Rep
Li Y, Zhang Z, Guo Y, Guo H, Zhang Z.
europepmc   +1 more source

Drop/impact simulation and test validation of telecommunication products

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 2002
Portable communication devices suffer impact-induced failure in usage. The products must pass drop/impact tests before shipment. The drop/impact performance is an important concern in product design. Due to the small size of this kind of electronic products, it is very expensive, time-consuming, and difficult to conduct drop tests to detect the failure
J. Wu, G. Song, C.-P. Yeh, K. Wyatt
openaire   +1 more source

Board level drop test and simulation of TFBGA packages for telecommunication applications

53rd Electronic Components and Technology Conference, 2003. Proceedings., 2004
Reliabilit!- perfonnance of IC packages during drop impact is critical, especially for handheld electronic products. Currently. thcrc is no detailed test standard in the industry to advise on the procedures for board level dmp test. nor there is any model Ilia1 providcs good correlation with experimental ineasiircinents of acceleration and impact life.
null Tong Yan Tee, null Hun Shen Ng, null Chwee Teck Lim, E. Pek, null Zhaowei Zhong   +4 more
openaire   +1 more source