Results 201 to 210 of about 67,866 (235)

Broadband generation and tomography of non-Gaussian states for ultra-fast optical quantum processors. [PDF]

Nat Commun
Kawasaki A, Ide R, Brunel H, Suzuki T, Nehra R, Nakashima K, Kashiwazaki T, Inoue A, Umeki T, China F, Yabuno M, Miki S, Terai H, Yamashima T, Sakaguchi A, Takase K, Endo M, Asavanant W, Furusawa A.   +18 more
europepmc   +1 more source

Patient and Clinician Perspectives on the Effectiveness of Current Telemedicine Approaches in Endocrinology Care for Type 2 Diabetes: Qualitative Study. [PDF]

JMIR Diabetes
Zupa M, Hamm M, Alexander L, Rosland AM.
europepmc   +1 more source

Hepatitis C Treatment Initiation During Hospitalization for People Who Use Drugs: A Narrative Review of the Literature. [PDF]

Open Forum Infect Dis
Denkins J, Babiarz J, Ham Y, Ryu H, Ricci B, Williams C, Alexander I, Tucker K, McCrary LM, Levander X.   +9 more
europepmc   +1 more source

Assignment of add–drop multiplexer (ADM) rings and digital cross-connect system (DCS) mesh in telecommunication networks

Journal of the Operational Research Society, 2001
This paper discusses a design of a hybrid ring–mesh network in a survivable communication network. Given a set of traffic demands, the problem is to assign each traffic demand to rings and mesh such that the cost of add–drop multiplexer (ADM) and digital cross-connect system (DCS) equipment required is minimized.
Lee, CY Lee, Chae Young, Koh, SJ
  +5 more sources

Drop/impact simulation and test validation of telecommunication products

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 2002
Portable communication devices suffer impact-induced failure in usage. The products must pass drop/impact tests before shipment. The drop/impact performance is an important concern in product design. Due to the small size of this kind of electronic products, it is very expensive, time-consuming, and difficult to conduct drop tests to detect the failure
K. Wyatt, C.-P. Yeh, G. Song, J. Wu
openaire   +3 more sources

Board level drop test and simulation of TFBGA packages for telecommunication applications

53rd Electronic Components and Technology Conference, 2003. Proceedings., 2004
Reliabilit!- perfonnance of IC packages during drop impact is critical, especially for handheld electronic products. Currently. thcrc is no detailed test standard in the industry to advise on the procedures for board level dmp test. nor there is any model Ilia1 providcs good correlation with experimental ineasiircinents of acceleration and impact life.
Tong Yan Tee, Hun Shen Ng, E. Pek, Zhaowei Zhong, Chwee Teck Lim   +4 more
openaire   +3 more sources

Testing The Connection Drop And Improving 4G Telecommunication Network And Accessing The Performance With 4G Network

2022 International Conference on Business Analytics for Technology and Security (ICBATS), 2022
S Balaji, S Stewart Kirubakaran
openaire   +2 more sources