Results 81 to 90 of about 5,849,923 (324)
Journal of Electrical and Computer Engineering
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Dislocation‐Mediated Thermoelectric Performance and Mechanical Behavior
Dislocations can scatter phonons to reduce thermal conductivity, thereby enhance thermoelectric performance. However, dislocations also impact mechanical properties, leading to increased brittleness and altered plasticity. It is essential to clarify the complex relationship between dislocations, thermal transport, and mechanical stability to achieve a ...
Bangzhi Ge, Yuan Yu, Chongjian Zhou
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Retracted: Covert Channel Construction Method Based on HTTP Composite Protocols
Journal of Electrical and Computer Engineering
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Ca2.5Ag0.3Sm0.2Co4O9 semiconductor materials are synthesized and produced in this study using the sol–gel and cold pressing techniques for thermoelectric generator applications. As template samples are added, the Seebeck coefficient and power factor values rise, peaking at 800 °C for Ca2.5Ag0.3Sm0.2Co4O9 at 274.47 μV K−1 and 0.58 mW mK−2, respectively.
Enes Kilinc+4 more
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Journal of Electrical and Computer Engineering
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The utilization of direct energy deposition (DED)‐arc additive manufacturing processes in industrial applications is increasing, and these processes have the potential for multi‐material applications. This work provides a overview of the state of research in DED‐arc made functional graded structures, to establish a link to potential industrial ...
Kai Treutler, Volker Wesling
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Journal of Electrical and Computer Engineering
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This study explores the effects of pixel size and spacing when fabricating electroluminescent (EL) multipixel displays. COMSOL simulations identify the impact of pixel dimensions and spacing on electric field distribution and lighting efficiency. Flexible, high‐resolution EL pixel arrays are reverse offset printed, achieving a 96% reduction in pixel ...
Huanghao Dai+3 more
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