Results 91 to 100 of about 643 (201)
, 2022 S.49-57This paper studies the CDM stress severity on radiofrequency integrated circuits (RF ICs). The ICs are housed in various IC package sizes and tested with both CDM and CC-TLP test methods. Empirical correlation factors are established based on peak
Weber, Johannes +5 more
core
VF-TLP round robin study, analysis and results
, 2022 4049The ESD Association's Workgroup 5.5 subcommittee is conducting a round robin study to determine the repeatability and reproducibility of measurements made the current VF-TLP Standard Practice.
Ashton, R. +11 more
core
Discharge Currents of Metallized Silicon Chiplets at Low Pre-Charge Voltages
This paper presents a new current sensor, which incorporates two microstrip lines: one designed for charging the device under test (DUT) and the other facilitating precise discharges into a 33 GHz oscilloscope.
Heiland, Leon +2 more
core +1 more source
Modeling of overhead transmission lines with line surge arresters for lightning overvoltages
, 2012 Lightning is one of the most significant source of overvoltages in overhead transmission lines. The lightning overvoltages could lead to failure of the devices connected to the transmission line.
Ranachowski, P +3 more
core
This study presents a methodology for assessing stress currents in multi-chip modules (MCM) during a CDM stress event. The relevant capacitances of the individual chips in a CDM test environment are obtained through FEM simulations and compared with ...
Graf, Michael +4 more
core +1 more source
Modeling of overhead transmission lines with line surge arresters for lightning overvoltages
, 2008 Lightning is one of the most significant source of overvoltages in overhead transmission lines. The lightning overvoltages could lead to failure of the devices connected to the transmission line.
Ranachowski, P +3 more
core
Case Study of a Miscorrelation Between CDM Testing and CC-TLP Characterization of Multi-GHz RF Pins
A peak current failure threshold miscorrelation was observed between CDM (~8.4A) testing and capacitively coupled (CC)-TLP (>11.5A) characterization of multi-GHz RF pins.
Weber, Johannes +2 more
core +1 more source
Cross Comparison Between Thermal Cycling and High Temperature Stress on I/O Connection Elements. [PDF]
Micromachines (Basel)Dhyani M +3 more
europepmc +1 more source
Genetic Algorithm-Optimized CNN-BiLSTM Framework for Predicting the Remaining Useful Life of IGBT Modules. [PDF]
Sensors (Basel)Hao Y +5 more
europepmc +1 more source