Results 251 to 260 of about 115,952 (294)

New Electro-Thermal Integrated Circuit Modeling using Coupling of Simulators

2006 Canadian Conference on Electrical and Computer Engineering, 2006
This paper describes a methodology developed to perform electro-thermal analysis of integrated circuits. This method is based on the relaxation approach. A circuit simulator and a thermal simulator which is a finite element program are coupled by an interface program.
S. Attar, M.C.E. Yagoub, F. Mohammadi
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Coupled electro-thermal-flow model for very long electric arcs

IEEE Transactions on Magnetics, 1997
A mathematical model that couples the electrical potential in the arc with the resulting thermal and flow fields has been developed to describe the behaviour of the arc plasma in a DC electric arc furnace. The set of conservation equations, along with a potential equation for the electric field, were solved using the PHOENICS software package.
null Wanping Hu, J.D. Lavers
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Electro‐Thermal Coupling Field Simulation of Converter Transformer Valve Side Bushings

IEEJ Transactions on Electrical and Electronic Engineering, 2020
In the actual operation, converter transformer valve side bushings are subjected to high voltages and large current loads with large number of harmonics simultaneously. In our previous papers, using the 3‐D electromagnetic‐fluid‐thermal coupling analysis method, the 3‐D temperature distribution of a converter transformer valve side bushing was ...
Qingyu Wang, Gengsheng Xie, Huidong Tian, Zongren Peng, Xi Yang   +4 more
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Coupled Electro-Thermal-Phase Change Modeling of a Chalcogenide Switch

Heat Transfer, Volume 3, 2006
A coupled electro-thermal-phase change numerical model is developed to model the threshold and memory switching processes in a chalcogenide switch based on phase change memory (PCM) technology. Coupled electrical and thermal transport coupled to phase change and crystallization kinetics are solved. Charge transport has been implemented using simplified
Navdeep Singh Dhillon, Jayathi Y. Murthy
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Fully coupled electro-thermal simulation of a micro pirani gauge

2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, 2010
In this paper, fully coupled electro-thermal simulation of a micro pirani gauge is presented. The simulation was carried out using CFD-ACE+ software, based on Finite Volume Method (FVM) for multi-disciplinary modeling. Temperature coefficient of resistance (TCR) of silicon was taken into account for solving the joule heating and heat transfer equations.
null Wei Jiang, null Jilong Zhou, null Xin Wang, null Long Wang, null Jinwen Zhang   +4 more
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NUMERICAL PROPERTIES OF A DISCONTINUOUS GALERKIN FOMULATION FOR ELECTRO-THERMAL COUPLED PROBLEMS

Proceedings of the VII European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS Congress 2016), 2016
Discontinuous Galerkin (DG) methods are attractive tools to integrate several PDEs in engineering sciences, due to their high order accuracy and their high scalability in parallel simulations. The main interest of this work is to derive a constant and stable Discontinuous Galerkin method for two-way electro-thermal coupling analyses.
Homsi, Lina, Geuzaine, Christophe, Noels, Ludovic   +2 more
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Coupled electro-thermal Simulations of single event burnout in power diodes

IEEE Transactions on Nuclear Science, 2005
Power diodes may undergo destructive failures when they are struck by high-energy particles during the off state (high reverse-bias voltage). This paper describes the failure mechanism using a coupled electro-thermal model. The specific case of a 3500-V diode is considered and it is shown that the temperatures reached when high voltages are applied are
A.M. Albadri, R.D. Schrimpf, D.G. Walker, S.V. Mahajan   +3 more
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Partially coupled electro-thermal analysis for accurate prediction of switching devices

Canadian Conference on Electrical and Computer Engineering 2001. Conference Proceedings (Cat. No.01TH8555), 2002
Power hybrid assemblies including IGBT (insulated gate bipolar transistor) are widely used in the application of motor drivers, switching supplies and other power conversion systems. The estimation of the power loss and junction temperature of semiconductor devices has become the major issue with the increase of the current density and high switching ...
A. Lakhsasi, Y. Hamri, A. Skorek
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Distributed and coupled 2D electro-thermal model of power semiconductor devices

The European Physical Journal Applied Physics, 2014
The development of power electronics in the field of transportations (automotive, aeronautics) requires the use of power semiconductor devices providing protection and diagnostic functions. In the case of series protections power semiconductor devices which provide protection may operate in shortcircuit and act as a current limiting device.
Belkacem, Ghania, Lefebvre, Stéphane, Joubert, Pierre-Yves, Bouarroudj-Berkani, Mounira, Labrousse, Denis, Rostaing, Gilles   +5 more
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Transient Electro-Thermal Coupled System Simulation - Modeling Approach and Experimental Validation

2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018
This contribution describes an approach for modeling a coupled electro-thermal design problem for the transient system simulation based on the analog circuit simulator SPICE - means: the time-varying electrical functional behavior of several neighboring components influence the time-varying thermal behavior of the setup and interconnection environment,
Ralph Schacht, Sven Rzepka
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