Results 251 to 260 of about 116,797 (291)

Electro-thermal coupling simulation of high power bipolar transistors

[1987] NASECODE V: Proceedings of the Fifth International Conference on the Numerical Analysis of Semiconductor Devices and Integrated Circuits, 1987
It is shown that a numerical iterative coupling process between an electrical model of high power bipolar transistors and a three-dimensional thermal model (based on the thermal influence coefficient method) of the transistor and its case well predicts the onset of an electro-thermal instability in this kind of devices.
A. Napieralski, J.M. Dorkel, P. Leturcq
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Localized statistical 3D thermal analysis considering Electro-Thermal coupling

2009 IEEE International Symposium on Circuits and Systems, 2009
In this paper, we propose a novel method for analyzing fewer hot spots in a chip. The method, called SNSOR (Single-Node Successive Over Relaxation), is based on a novel localized relaxed iterative approach to perform statistical analysis on one hot spot at a time.
null Zuying Luo, Jeffrey Fan, Sheldon X.-D. Tan   +2 more
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Coupled electro-thermal simulation of a DC/DC converter

Microelectronics Reliability, 2007
Electro-thermal simulation of a DC/DC converter using a two-step methodology and its experimental validation are presented in this paper. The simulation technique is based on the coupling of a thermal simulator (FLOTHERM) and an electrical one based on VHDL-AMS language.
Miquel Vellvehi, Xavier Jordà, Philippe Godignon, Carles Ferrer, José Millán   +4 more
openaire   +1 more source

Parametric Model Order Reduction for Electro-Thermal Coupled Problems

2019
We consider automatic parametric model order reduction for electro-thermal (ET) coupled problems arising from (nano-)microelectronic simulations. We show that the PMOR method based on multi-moment matching proposed in [2] can be applied to the discretized ET models. The error bound in [6] is used to check the accuracy of the reduced models.
Feng, L., Benner, P. ; https://orcid.org/0000-0003-3362-4103   +1 more
openaire   +3 more sources

Package Reliability Analysis with Coupled Electro-Thermal and Mechanical Modeling

MRS Proceedings, 2013
ABSTRACTPower consumption and dissipation during electrical operation lead to a temperature rise in the package. Elevated temperature in the package structure induces thermo-mechanical stresses which may increase reliability risks. Robust and reliable package design for power systems requires comprehensive analysis of system electrical, thermal, and ...
Chan-Su Yun, Xiaopeng Xu, Arsen Terterian, Tommaso Cilento   +3 more
openaire   +1 more source

New Electro-Thermal Integrated Circuit Modeling using Coupling of Simulators

2006 Canadian Conference on Electrical and Computer Engineering, 2006
This paper describes a methodology developed to perform electro-thermal analysis of integrated circuits. This method is based on the relaxation approach. A circuit simulator and a thermal simulator which is a finite element program are coupled by an interface program.
S. Attar, M.C.E. Yagoub, F. Mohammadi
openaire   +1 more source

Coupled electro-thermal-flow model for very long electric arcs

IEEE Transactions on Magnetics, 1997
A mathematical model that couples the electrical potential in the arc with the resulting thermal and flow fields has been developed to describe the behaviour of the arc plasma in a DC electric arc furnace. The set of conservation equations, along with a potential equation for the electric field, were solved using the PHOENICS software package.
null Wanping Hu, J.D. Lavers
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Electro‐Thermal Coupling Field Simulation of Converter Transformer Valve Side Bushings

IEEJ Transactions on Electrical and Electronic Engineering, 2020
In the actual operation, converter transformer valve side bushings are subjected to high voltages and large current loads with large number of harmonics simultaneously. In our previous papers, using the 3‐D electromagnetic‐fluid‐thermal coupling analysis method, the 3‐D temperature distribution of a converter transformer valve side bushing was ...
Qingyu Wang, Gengsheng Xie, Huidong Tian, Zongren Peng, Xi Yang   +4 more
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Coupled Electro-Thermal-Phase Change Modeling of a Chalcogenide Switch

Heat Transfer, Volume 3, 2006
A coupled electro-thermal-phase change numerical model is developed to model the threshold and memory switching processes in a chalcogenide switch based on phase change memory (PCM) technology. Coupled electrical and thermal transport coupled to phase change and crystallization kinetics are solved. Charge transport has been implemented using simplified
Navdeep Singh Dhillon, Jayathi Y. Murthy
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Fully coupled electro-thermal simulation of a micro pirani gauge

2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems, 2010
In this paper, fully coupled electro-thermal simulation of a micro pirani gauge is presented. The simulation was carried out using CFD-ACE+ software, based on Finite Volume Method (FVM) for multi-disciplinary modeling. Temperature coefficient of resistance (TCR) of silicon was taken into account for solving the joule heating and heat transfer equations.
null Wei Jiang, null Jilong Zhou, null Xin Wang, null Long Wang, null Jinwen Zhang   +4 more
openaire   +1 more source