Results 101 to 110 of about 1,286,418 (308)

Ionic Liquid‐Based Reversible Metal Electrodeposition for Adaptive Radiative Thermoregulation Under Extreme Environments

open access: yesAdvanced Functional Materials, EarlyView.
A wideband tunable electrochromic device with dynamic thermal emissivity control is demonstrated. The system enables adaptive heat regulation via electrochemically modulated silver deposition, achieving efficient cooling and heating states. The flexible design ensures mechanical robustness under bending conditions, making it promising for portable and ...
Jiawei Liang   +10 more
wiley   +1 more source

Versatile Selective Soldering via Molten Metal Printing for Heat‐Sensitive 3D Electronics and Smart Wearables

open access: yesAdvanced Functional Materials, EarlyView.
Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger   +4 more
wiley   +1 more source

Print‐and‐Plate Architected Electrodes for Electrochemical Transformations Under Flow

open access: yesAdvanced Functional Materials, EarlyView.
Typical flow cell electrodes are composed of stochastic porous carbon, limiting understanding of electrode structure‐performance relationships. This work describes an approach, termed “print‐and‐plate,” to prepare porous electrodes by direct ink writing followed by conformal metal coating.
Dylan M. Barber   +12 more
wiley   +1 more source

Electrochemical Behavior of Ion Exchange Resin Membrane Electrodes

open access: bronze, 1955
Harold E. Affsprung   +2 more
openalex   +1 more source

Harnessing Outer Space for Improved Electrocaloric Cooling

open access: yesAdvanced Functional Materials, EarlyView.
A novel radiative heat sink/source‐integrated electrocaloric (R‐iEC) system combines the electrocaloric (EC) effect with a thermally conductive radiative cooler (TCRC) to address heat dissipation limitations in EC devices. Utilizing outer space as a heat sink, the system achieves up to 240 W m−2 of heat dissipation performance, making it highly ...
Dong Hyun Seo   +8 more
wiley   +1 more source

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