Results 51 to 60 of about 1,286,418 (308)

Organic electrode coatings for next-generation neural interfaces [PDF]

open access: yes, 2014
Traditional neuronal interfaces utilize metallic electrodes which in recent years have reached a plateau in terms of the ability to provide safe stimulation at high resolution or rather with high densities of microelectrodes with improved spatial ...
Abidian   +222 more
core   +2 more sources

Evaluating Dielectric Properties for Semicrystalline Thermoplastics to Analyze the Thermal and Rheological Properties in Laser‐Based Powder Bed Fusion of Plastics

open access: yesAdvanced Engineering Materials, EarlyView.
This study aims to establish a link between the dielectric properties of polyamide 12 (PA12) and its thermal and rheological properties using dielectric analysis (DEA). A standardized methodology is introduced to determine melting and crystallization temperatures.
Benedikt Burchard   +2 more
wiley   +1 more source

Integration of a sensor system into microfluidic chips [PDF]

open access: yes, 2010
There have been considerable developments in the field of potentiometric sensors in recent years mainly with respect to lowering detection limits and making sensors smaller, solid-state, robust and less expensive.[1, 2] In potentiometric measurements two
Anastasova, Salzitsa   +6 more
core  

Optimized Strategy for Fabricating High‐Aspect‐Ratio Periodic Structures Over Large Areas Using ps‐Direct Laser Interference Patterning

open access: yesAdvanced Engineering Materials, EarlyView.
Picosecond direct laser interference patterning (DLIP) enables precise microstructure fabrication on stainless steel. Using a multiscan approach, high‐aspect‐ratio patterns are achieved. Fluence influences structure growth and homogeneity, with smaller periods yielding better uniformity.
Fabian Ränke   +5 more
wiley   +1 more source

Sol–Gel Synthesis of Ca2.5Ag0.3Sm0.2Co4O9 Semiconducting Materials for Thermoelectric Applications in Aerospace Systems

open access: yesAdvanced Engineering Materials, EarlyView.
Ca2.5Ag0.3Sm0.2Co4O9 semiconductor materials are synthesized and produced in this study using the sol–gel and cold pressing techniques for thermoelectric generator applications. As template samples are added, the Seebeck coefficient and power factor values rise, peaking at 800 °C for Ca2.5Ag0.3Sm0.2Co4O9 at 274.47 μV K−1 and 0.58 mW mK−2, respectively.
Enes Kilinc   +4 more
wiley   +1 more source

Titanium‐S23: A New Alloy with Ultra‐High Tensile Toughness Directly from the Solid‐State Processing of Recycled Ti–6Al–4V and Ti–5Al–5Mo–5V–3Cr Powders using Field Assisted Sintering Technology

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores combining two existing aerospace titanium alloy powders, processing them via field‐assisted sintering technology and the subsequent discovery of a novel alloy composition, termed S23, with ultra‐high tensile toughness. Fine‐scale alpha precipitates favorably form in the alloy despite the relatively slow cooling, providing an ...
Samuel Lister   +2 more
wiley   +1 more source

Photoelectrochemical electrodes [PDF]

open access: yes, 1983
The surface of a moderate band gap semiconductor such as p-type molybdenum sulfide is modified to contain an adherent film of charge mediating ionene polymer containing an electroactive unit such as bipyridimium.
Rembaum, A., Williams, R. M.
core   +1 more source

New Developments in the Field of Production and Application of Multi‐Material Wire Arc Additive Manufacturing Components: A Review

open access: yesAdvanced Engineering Materials, EarlyView.
The utilization of direct energy deposition (DED)‐arc additive manufacturing processes in industrial applications is increasing, and these processes have the potential for multi‐material applications. This work provides a overview of the state of research in DED‐arc made functional graded structures, to establish a link to potential industrial ...
Kai Treutler, Volker Wesling
wiley   +1 more source

High‐Resolution Reverse Offset Printed Electroluminescent Multipixel Arrays for Scalable Future Wearable Displays

open access: yesAdvanced Engineering Materials, EarlyView.
This study explores the effects of pixel size and spacing when fabricating electroluminescent (EL) multipixel displays. COMSOL simulations identify the impact of pixel dimensions and spacing on electric field distribution and lighting efficiency. Flexible, high‐resolution EL pixel arrays are reverse offset printed, achieving a 96% reduction in pixel ...
Huanghao Dai   +3 more
wiley   +1 more source

Multimodal Characterization Method for Metamaterials with Tunable Mechanical Stiffness and Electrical Resistivity

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents a multimodal characterization method for a prototype metamaterial model structure that features four distinct states of mechanical stiffness and electrical resistivity. Through simulations and experiments, it uncovers insights into the structural behavior, the correlation between changes in electrical resistivity and mechanical ...
Rebecca Kose   +3 more
wiley   +1 more source

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