Results 91 to 100 of about 2,244 (141)

Electroless deposition in nanotechnology and ULSI

Microelectronic Engineering, 2003
The technology of electroless metallization was developed enabling one to adequately replace Au and Ag with Ni-P or Ni-B alloys in industry and to significantly simplify the metallization process. Other proposed nanotechnologies for the first time allow one to produce photomasks and microdevices with nano-sized adjacent elements of different ...
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The Electrochemistry of Electroless Deposition of Copper

Journal of The Electrochemical Society, 1979
A two‐chamber galvanic cell enabled the simultaneous study of both oxidation and reduction processes involved in electroless copper deposition. The standing electrode potentials as well as the coupled electrode potentials were measured in the catholyte (, , Rochelle salt) and in the anolyte (, , Rochelle salt).
S. M. El‐Raghy, A. A. Abo‐Salama
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Electroless Alloy Deposition

1994
AbstractMetallic nonelectrolytic alloy coatings produced from aqueous solutions are commercially used in several industries, including electronics, aerospace, medical, oil and gas production, chemical processing, and automotive. Nonelectrolytic coating systems use two types of reactions to deposit metal onto a part: electroless and displacement.
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Photocatalytic initiation of electroless deposition

Journal of Photochemistry and Photobiology A: Chemistry, 2010
Abstract We report a one-step photocatalytically initiated electroless deposition (PIED) process that allows for the photogeneration of robust, coherent, conducting metal layers on semiconductor-sensitised insulator surfaces. The PIED process involves two steps, performed simultaneously in the same metal precursor solution: (i) Metal nanoparticles
Bromley, Michael A., Boxall, Colin, Galea, Sarah, Goodall, Philip S., Woodbury, Simon   +4 more
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Electroless Nickel-Phosphorus Deposits

2019
Electroless nickel-phosphorous (NiP) was the first electroless deposited coating, in the moment of this plating technique discovery. Electroless nickel coatings have become very popular over the time due to their easy process and relatively cheaper and simple setup. Binary NiP coating is a dense alloy of nickel and phosphorus.
Suman Kalyan Das, Prasanta Sahoo
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Electroless Deposition of Metals and Alloys

1992
The process of electrodeposition of metal M $${\rm{M}}_{{\rm{solution}}}^{z + } + z{e^ - }\mathop \to \limits^{{\rm{electrode}}} {{\rm{M}}_{{\rm{lattice}}}}$$ (1) is a process in which z electrons, supplied by an external power supply, are injected into the electrode and captured by metal ions M z+ in the solution, resulting in M in the ...
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Electroless Atomic Layer Deposition

ECS Meeting Abstracts, 2014
Atomic layer deposition (ALD) is a group of methods for the formation of nanofilms of materials, an atomic layer at a time using surface limited reactions. The majority of those methods are based on use of the vacuum environment. However there are methods such as sequential ionic layer adsorption reaction (SILAR) which used the condensed phase, that ...
John Lewellen Stickney, David M. Benson, Kaushik Jagannathan, David B. Robinson   +3 more
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Electroless deposition of semiconductor films

Thin Solid Films, 1979
Abstract An electroless (solution growth) technique for the deposition of thin films of a variety of multicomponent alloys ( e.g. Cd 1− x Zn x S, Pb 1− x Hg x S and Cd 1− x Pb x Se) of II–VI and IV–VI semiconductors has been developed. The technique involves the recombination on a suitably prepared substrate of two or more ions produced ...
N.C. Sharma, R.C. Kainthla, D.K. Pandya, K.L. Chopra   +3 more
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Electroless Deposition Processes and Tools

2009
Electroless deposition, which was introduced in 1946 by Brenner and Riddell [1], is a type of electrochemical deposition that is gaining interest in semiconductor and related applications. Electroless deposition utilizes complementary electrochemical reactions to cause metal deposition.
Z. Hu, T. Ritzdorf
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Electroless Deposition of Poly(2-alkoxyaniline)s

Langmuir, 2004
The in situ deposition of poly(2-alkoxyaniline)s onto oxide surfaces is reported. It is demonstrated that the identity of the substrate can have a pronounced effect on the polymerization rate of these substituted polyanilines. Poly(2-alkoxyaniline)s deposit efficiently onto indium-doped tin oxide (ITO), but deposition onto quartz proceeds slowly.
Maciej, Mazur, G J, Blanchard
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