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Dual-Gradient Impedance/Insulation Structured Polyimide Nonwoven Fabric for Multi-Band Compatible Stealth. [PDF]

open access: yesNanomicro Lett
Tang X   +10 more
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An Investigation of Tin Electroless Deposition

ECS Meeting Abstracts, 2022
Electroless metal/alloy deposition can be an efficient process in certain areas of microelectronic fabrication. In fact, it is often easier to obtain coatings of uniform thickness and composition using electroless deposition than with electrodeposition, since one does not have the current density uniformity problem of the latter.
Eugene J. O'Sullivan   +4 more
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Electroless Deposition of Metals

Transactions of the IMF, 2001
(2001). Electroless Deposition of Metals. Transactions of the IMF: Vol. 79, No. 1, pp. 41-46.
Charlie Kerr, Des Barker, Frank Walsh
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Electroless Deposition of Metals

Transactions of the IMF, 1981
Abstract The autocatalytic deposition of metals is introduced. The actions of the various components of electroless plating solutions are detailed and the operating conditions are summarized. The structure and composition of the deposits are discussed. The properties of the process and its applications are also discussed.
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On the Mechanism of Electroless Copper Deposition

Berichte der Bunsengesellschaft für physikalische Chemie, 1987
AbstractThe mechanism of electroless copper deposition with formaldehyde from alkaline ethylenediamine‐tetraacetate (EDTA)‐containing solutions was studied. Oxidation and reduction could be investigated separately by use of a quartz microbalance in combination with fast solution exchange.
Harm Wiese, Konrad Georg Weil
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PATTERN FORMATION IN ELECTROLESS DEPOSITION

Fractals, 1995
Metal-forest patterns of electroless deposits of silver and gold in thin-layer aqueous solutions were studied in connection with their chemical reactions. While the silver metal-forest with a simple redox reaction of Cu and Ag+ showed a DLA (diffusion limited aggregation)-like pattern, the gold metal-forest with a redox reaction of Pb and [Formula ...
IWAO MOGI, SUSUMU OKUBO
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(Invited) Electroless Deposition Revisited

ECS Meeting Abstracts, 2019
After some early successes with electroless Cu for printed circuit board wiring (1), and the use of electroless Co-based magnetic films over non-magnetic electroless nickel films on rigid Al disks in the magnetic storage industry, for several years, electroless deposition was never far from researchers’ interest in the field of microelectronics. This
E. J. O'Sullivan   +8 more
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