Results 181 to 190 of about 8,209,944 (376)

A Simulative Approach for the Prediction of Mesoscale Residual Stress Fields in Solution‐Strengthened Ferritic Ductile Iron

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents a 3D representative volume element‐based simulation approach to predict mesoscopic residual stress and strain fields in silicon solid solution‐strengthened ductile cast iron. By modeling phase transformation kinetics with an enhanced Johnson–Mehl–Avrami–Kolmogorov model, the effects of varying cooling rates on residual stresses are ...
Lutz Horbach   +6 more
wiley   +1 more source

Mechanical Behavior and Microstructural Changes Associated with Tensile Deformation above the Martensite Start Temperature during Quenching and Subsequent Partitioning of a Low‐Alloy 37SiB6 Steel

open access: yesAdvanced Engineering Materials, EarlyView.
A new experimental setup, incorporating digital image correlation and infrared thermography in combination with inductive‐conductive heating for precise temperature control, is used to analyze the mechanical behavior and microstructural changes of sheet metal under complex thermomechanical test conditions that represent quench and partitioning ...
Christian Illgen   +4 more
wiley   +1 more source

Vacuum‐Formed Composites Based on a Polyolefin and a High Content of Biomass‐Waste Fillers

open access: yesAdvanced Engineering Materials, EarlyView.
It is shown here that by the use of a very ductile polymer matrix, it is possible to vacuum‐form products that contain up to 25% of hard biofillers with still ductile properties. The results are promising and opens up for the use of engineered biocomposites derived from industrial side‐stream biofillers in vacuum‐formed products. A strategy to increase
Susanna K. Källbom   +6 more
wiley   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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