Results 161 to 170 of about 4,920,547 (298)

Comparison of three commercial multi-energy CT and electron density phantoms for iodine quantification and tissue substitute characterization. [PDF]

J Appl Clin Med Phys
Omar A, Vorbau R, Zimmerman J, Poludniowski G.   +3 more
europepmc   +1 more source

Electron densities in active galaxies [PDF]

Nature, 1983
openaire   +2 more sources

Electronic Charge Densities in Semiconductors [PDF]

Physical Review Letters, 1971
Walter, John P., Cohen, Marvin L.
openaire   +2 more sources

Influence of TiC and TiN Ceramic Reinforcements on the Microstructure, Thermal Expansion Behavior, and Tensile Properties of Invar 36 Manufactured by Laser Powder Bed Fusion

Advanced Engineering Materials, EarlyView.
This study examines Invar composites reinforced with titanium carbide (TiC) and titanium nitride (TiN) using laser powder bed fusion (LPBF). It presents the influence of reinforcements on microstructure, tensile properties, and thermal expansion. Results show that TiC effectively strengthens Invar while maintaining low thermal expansion, whereas TiN ...
Ayodeji Nathaniel Oyedeji, Natasha Sacks, Johannes Pötschke, Björn Matthey   +3 more
wiley   +1 more source

Spectral CT Electron Density Mapping for Lung Biopsy Targeting. [PDF]

Radiol Imaging Cancer
Hu Y, Sun H.
europepmc   +1 more source

Rapidly Solidified High‐Strength Invar 36 Prepared by Planar‐Flow Melt Spinning

Advanced Engineering Materials, EarlyView.
The Invar 36 alloy was rapidly solidified using the planar‐flow melt‐spinning technique. Ribbon samples with thicknesses ranging from 20 to 160 mm were produced. As the grain size of the ribbon decreased to sub‐micron levels, the hardness increased by more than 2 times.
Bekir Akgül, Mehmet Kul
wiley   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

Advanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová, Markéta Klimtová, Mohd Faizul Mohd Sabri, Yew Hoong Wong, Petr Veselý, Martin Plaček, Karel Dušek   +6 more
wiley   +1 more source

Evaluation of anemia in non-enhanced and contrast-enhanced dual-energy CT using electron density imaging. [PDF]

PLoS One
Kim C, Yeom SK, Choi H, Shim E, Hwang SH, Yong HS, van Assen M, De Cecco CN, Sung HJ, Lee SR.   +9 more
europepmc   +1 more source

Morphology, Transport, and Dynamics of Protein Adsorption in Open‐Cell Metal Foam

Advanced Engineering Materials, EarlyView.
Stainless steel (SS) open‐cell foams are shown to adsorb more protein per unit area than previously reported 316L SS and chromium oxide surfaces under static and flow conditions. An integrated approach combining 3D pore imaging, flow simulation, and protein adsorption experiments characterizes the foam’s performance.
Chinmaya Prerana Inguva, Joseph Lavoie, Afsaneh Rabiei   +2 more
wiley   +1 more source

Molecular Dynamics and Electron Density Topology Reveal Ligand-Specific Interaction Patterns at the Dopamine D₂ Receptor. [PDF]

Int J Mol Sci
Padilla-Bernal G, Herrera-Zúñiga LD, Vargas R.   +2 more
europepmc   +1 more source