Results 61 to 70 of about 440,979 (305)
Recently, thanks to the technological advances, electronic devices are getting smaller in size. This causes an increase in the heat generation per unit area.
Burcu Çiçek
doaj +1 more source
Recent advancements in imaging, electronics, and computer science have engendered significant progress in non-destructive testing and quality monitoring within the agro-food industry.
P. Pathmanaban +3 more
doaj +1 more source
Cooling of a suspended nanowire by an AC Josephson current flow [PDF]
We consider a nanoelectromechanical Josephson junction, where a suspended nanowire serves as a superconducting weak link, and show that an applied DC bias voltage an result in suppression of the flexural vibrations of the wire.
Gorelik, Leonid Y. +4 more
core +2 more sources
Comment on “Coherent Electron Cooling”
A Comment on the Letter by V. N. Litvinenko and Y. S. Derbenev, Phys. Rev. Lett. 102, 114801 (2009). The authors of the Letter offer a Reply.
G, Stupakov, M S, Zolotorev
openaire +3 more sources
High‐temperature interactions between low‐sulfur Al‐killed Mn–B steel and MgO–C refractories (0 and 50 wt% recyclates) are studied via finger immersion tests (1600 °C). Surface‐active elements influence infiltration. MgO/CaS layer forms, along with spinel and calcium silicate.
Matheus Roberto Bellé +5 more
wiley +1 more source
The flow in channels of microdevices is usually in the developing regime. Three-dimensional laminar flow characteristics of a nanofluid in microchannel plate fin heat sinks are investigated numerically in this paper. Deionized water and Al2O3−water
Hao Ma +5 more
doaj +1 more source
Cooling the Electronic Brain [PDF]
This article discusses findings of some immersion cooling studies carried out to define the potential of direct liquid cooling of three-dimensional chip stacks. Four possible immersion cooling strategies were assessed. These included two active cooling strategies and two passive cooling strategies.
Avram Bar-Cohen, Karl J. L. Geisler
openaire +1 more source
This study investigates the tribological response of 60NiTi alloy under dry, water‐lubricated and high‐temperature conditions. The alloy exhibits decreasing wear volume and friction with increasing temperature due to the formation of protective oxide layers. The work clarifies dominant wear mechanisms and demonstrates the suitability of 60NiTi for high‐
Anthony Onyebuchi Okoani +2 more
wiley +1 more source
Enhancing Heat Transfer in Square Pin Fin Heatsinks with Slots using Computational Fluid Dynamics
Crucial for maintaining electronic device performance and longevity is effective thermal management. This study investigates two innovative heat sink configurations: the Square pin fin and the Slotted square pin fin.
NGUYEN Duy-Tue, BUI Manh-Ha
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This paper describes the procedure of design and manufacture of a micro-ejector proposed for miniature ejection refrigeration systems. It describes the procedure of design, fabrication, and experimentation on supersonic micro-ejectors and makes the case ...
Kamil Śmierciew +4 more
doaj +1 more source

