Results 41 to 50 of about 7,200,747 (248)
Investigation of the Effect of Fin Geometry on the Thermal Performance of Microelectronic Devices
This study systematically evaluates the optimal heat sink geometry for enhanced thermal performance in electronic cooling applications. ANSYS-Icepak and COMSOL Multiphysics software assessed four distinct fin geometries (square, rectangular, circular ...
Sana J. Yaseen +3 more
doaj +1 more source
A Practical Noise2Noise Denoising Pipeline for High‐Throughput Raman Spectroscopy
A lightweight and reproducible denoising pipeline for high‐throughput Raman spectroscopy is introduced, based on a 1D convolutional autoencoder trained with a Noise2Noise strategy. Using only repeated short‐exposure acquisitions, the method suppresses stochastic noise without reference spectra, enabling reliable spectral reconstruction while preserving
David Martin‐Calle +5 more
wiley +1 more source
In this study, three dimensional mixed convection heat transfer from discrete heat sources placed in a horizontal rectangular channel has been investigated numerically.
Ayla Doğan +2 more
doaj +1 more source
Recent advancements in imaging, electronics, and computer science have engendered significant progress in non-destructive testing and quality monitoring within the agro-food industry.
P. Pathmanaban +3 more
doaj +1 more source
The OntOMat ontology establishes a structured framework for polymer matrix fiber reinforced composite materials, integrating manufacturing processes, characterization methods, and multiscale design through the VDI/VDE 3682 formalized process description standard.
Nicolas Christ +19 more
wiley +1 more source
Deep‐UV (258 nm) femtosecond pulses enable uniform amorphous silicon writing on Si(100)/(111) with a six‐fold larger fluence amorphization window than NIR methods. Optimized fluence and overlap yield 20–45 nm uniform and continuous amorphous layers. Microscopy shows sharp interfaces, and real‐time reflectivity reveals nanosecond melt–resolidification ...
Wissal Benali +5 more
wiley +1 more source
Review of Electronic Cooling and Thermal Management in Space and Aerospace Applications
The continuous miniaturization of electronics, high processing capacity, compact microelectronic devices, and high circuit density contribute to an increasing demand for the efficient cooling of electronics.
Kivilcim Ersoy
doaj +1 more source
Effect of phase change materials on heat dissipation of a multiple heat source system
This paper experimentally investigates heat dissipation of a heat pipe with phase change materials (PCMs) cooling in a multiple heat source system. Two heat sources are fixed at one end of the heat pipe.
Yu Kai +5 more
doaj +1 more source
Advanced Study of Spray Cooling: From Theories to Applications
With the continuous integration and miniaturization of electronic devices, the heat transfer of the electronic devices continues to surge. This means that thermal management equipment with higher heat flux cooling capacity is required to maintain its ...
Tianshi Zhang +7 more
doaj +1 more source
Solvate ionic liquids lubrication reduced the coefficient of friction by ∼60% compared to dry sliding, reaching steady‐state values as low as 0.04–0.05. Corrosion weight‐loss measurements in 1 M HCl further demonstrated significant inhibition behavior, with only 100 ppm of [Li(G3)][TFSI] (∼68.5 μL/L) reducing corrosion‐product weight loss by 63 ...
Sameh Dabees +6 more
wiley +1 more source

