Results 31 to 40 of about 88,401 (266)

Is an Apple an Orange? A Large Language Model Benchmark for Candidate Term Extraction and Subclass Decisions Against Upper Ontologies in Engineering and Materials Science

open access: yesAdvanced Engineering Materials, EarlyView.
Building machine‐readable vocabularies for materials science is slow, expert‐driven work. This study benchmarks 13 large language models on two of its first steps: finding candidate terms in engineering articles and deciding where they belong in a class hierarchy.
Thomas Bjarsch   +3 more
wiley   +1 more source

Cooling and Diffusion Rates in Coherent Electron Cooling Concepts

open access: yes, 2021
Proceedings of the 12th International Particle Accelerator Conference, IPAC2021, Campinas, SP ...
Nagaitsev, Sergei   +4 more
openaire   +2 more sources

Dynamical backaction cooling with free electrons [PDF]

open access: yesNature Communications, 2015
AbstractThe ability to cool single ions, atomic ensembles, and more recently macroscopic degrees of freedom down to the quantum ground state has generated considerable progress and perspectives in fundamental and technological science. These major advances have been essentially obtained by coupling mechanical motion to a resonant electromagnetic degree
Nigues, A., Siria, A., Verlot, Pierre
openaire   +4 more sources

Recycling of NiTi Shape Memory Alloys: Fundamental and Technological Aspects of a Vacuum Induction Melting Processing Route

open access: yesAdvanced Engineering Materials, EarlyView.
The present study investigates recycling of NiTi shape memory alloys via vacuum induction melting. An ingot was synthesized from elemental Ni and Ti and subjected to three subsequent remelting cycles. Remelting increases process durations and impurity levels and adversely affects microstructures and functional properties.
Sakia Sophia Noorzayee   +7 more
wiley   +1 more source

Pressure Drop of Microchannel Plate Fin Heat Sinks

open access: yesMicromachines, 2019
The entrance region constitutes a considerable fraction of the channel length in miniaturized devices. Laminar slip flow in microchannel plate fin heat sinks under hydrodynamically developing conditions is investigated semi-analytically and numerically ...
Zhipeng Duan   +4 more
doaj   +1 more source

Effect of the Configuration and Shape of External Ribs of Sealed Enclosures of Electronic Devices on Heat Removal Efficiency

open access: yesИзвестия высших учебных заведений России: Радиоэлектроника, 2023
Introduction. Modern computing and electronic devices are constructed on the basis of radio-electronic components, such as processors, graphics processing units, etc. During operation, these components emit tens of watts of thermal energy.
G. А. Piskun   +5 more
doaj   +1 more source

Comparison of Triply Periodic Minimal Surface Energy Absorbers Under Uniaxial Compressive Loading

open access: yesAdvanced Engineering Materials, EarlyView.
This study investigates LCD 3D printed Triply Periodic Minimal Surface (TPMS) structures as mechanical energy absorbers. By comparing various base designs and layered combinations under uniaxial compression, it identifies that a Diamond‐Gyroid sandwich structure offers superior performance.
Sergej Grednev   +2 more
wiley   +1 more source

Oscillating piezofan effects on natural and forced convection flow in a vertical channel with protru

open access: yesJournal of Thermal Engineering
The current work investigates the flow characteristics and convective heat transfer performance of a vertically-oriented piezofan in a channel with wall-mounted protruding heat sources. A 2D numerical model is developed in COMSOL Multiphysics to simulate
Salim lbrahim HASAN   +2 more
doaj   +1 more source

Numerical investigation of heat transfer from heat sources placed in a horizontal rectangular channel

open access: yesCumhuriyet Science Journal, 2020
In this study, three dimensional mixed convection heat transfer from discrete heat sources placed in a horizontal rectangular channel has been investigated numerically.
Ayla Doğan   +2 more
doaj   +1 more source

Novel cooling strategy for electronic packages: Directly injected cooling [PDF]

open access: yesCIRP Journal of Manufacturing Science and Technology, 2009
This publication describes the development of a novel cooling strategy for electronic packages. During the conceptual design phase, the engineering disciplines involved are considered simultaneously. Through a case study, it is demonstrated that this integrative approach is an effective methodology leading to an innovative design. A novel, improved and
Wits, Wessel Willems   +3 more
openaire   +2 more sources

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