Results 11 to 20 of about 88,401 (266)

Impact of Microgroove Shape on Flat Miniature Heat Pipe Efficiency

Entropy, 2018
Miniature heat pipes are considered to be an innovative solution able to dissipate high heat with low working fluid fill charge, provide automatic temperature control, and operate with minimum energy consumption and low noise levels.
François Ternet, Hasna Louahlia-Gualous, Stéphane Le Masson   +2 more
doaj   +1 more source

Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System

Energies, 2019
In order to better release the heat generated by the electronic components, a novel heat dissipation system is proposed, which combines a microchannel heat pipe (MHP) with a high thermal conductivity and a radiative plate with a high emissivity at ...
Cairui Yu, Dongmei Shen, Qingyang Jiang, Wei He, Hancheng Yu, Zhongting Hu, Hongbing Chen, Pengkun Yu, Sheng Zhang   +8 more
doaj   +1 more source

Energy-Efficient Thermal Management of Periodic Electronic Cavities Using the Cascaded Lattice Boltzmann Method: Optimization of the Air Inlet Inclination [PDF]

EPJ Web of Conferences
Efficient thermal management remains a major challenge in compact electronic systems, where increasing power density and confined geometries exacerbate heat accumulation and non-uniform temperature fields.
Amine Fatima Zahra Laktaoui, Jadal Mariam, Errebii Mohamed, Dhilou Abdeslem, Anflous Abdelhakim, Rhouzali Mohamed, El Alami Mustapha, Semma Elalami   +7 more
doaj   +1 more source

Electron cooling experiments in CSR [PDF]

Science China Physics, Mechanics and Astronomy, 2011
5 pages 11 ...
XiaoDong Yang, Jie Li, LiJun Mao, GuoHong Li, XiaoMing Ma, TaiLai Yan, RuiShi Mao, JianCheng Yang, YouJin Yuan, Vasily Parkhomchuk, Vladimir Reva   +10 more
openaire   +2 more sources

Modulating Surface Chemistry of Al Powders for Elastomeric Composites with Applications in Electronic Cooling

Advanced Materials Interfaces, 2023
Elastomeric composites are an important class of thermal interface materials as they are shape‐adaptive, which can fit uneven interfaces and achieve ideal interfacial heat transfer in electronic cooling.
Qiangqiang Ma, Chenxu Zhang, Linlin Ren, Xiaoliang Zeng, Jian‐Bin Xu, Rong Sun, Yimin Yao   +6 more
doaj   +1 more source

Geometric modification and placement of high heat flux ic chips on substrates of different materials

Journal of Thermal Engineering, 2023
This article presents the significance of using different sizes and positions of IC (Integrated Circuit) chips that are mounted on substrates of different materials. 1631The ICs are cooled by forced convection in a horizontal wind tunnel.
Shankar DURGAM, Ajinkya BHOSALE, Vivek BHOSALE   +2 more
doaj   +1 more source

Experimental Investigation of Free Convection from Foam Heat Sinks in an Inclined Rectangular Channel

Cumhuriyet Science Journal, 2018
Inthis present study, free convection from an in-line 5x1 array of aluminum foamheat sinks which were placed on the bottom wall of the inclined rectangularchannel was investigated.
Ayla Doğan, Oğuzhan Özbalcı
doaj   +1 more source

Analysis of the temperature evolution of the canned motor with spiral tube heat exchanger in secondary water supply blackout fault

Scientific Reports
In a canned motor with a spiral tube heat exchanger for a nuclear main pump, if the secondary water suddenly fails, the temperature of the lubricating water and motor winding insulation must not exceed the alarm or permitted value within the 5 min ...
Li-Kun Ai, Yi-Ping Lu
doaj   +1 more source

Improvement of the Thermal Performance of PCM-Based Heat Sink Used in Electronic Cooling by Adding Nano-Particles

Gazi Üniversitesi Fen Bilimleri Dergisi
Recently, thanks to the technological advances, electronic devices are getting smaller in size. This causes an increase in the heat generation per unit area.
Burcu Çiçek
doaj   +1 more source

Comment on “Coherent Electron Cooling”

Physical Review Letters, 2013
A Comment on the Letter by V. N. Litvinenko and Y. S. Derbenev, Phys. Rev. Lett. 102, 114801 (2009). The authors of the Letter offer a Reply.
G, Stupakov, M S, Zolotorev
openaire   +3 more sources