Results 11 to 20 of about 7,200,747 (248)
On-chip micro-evaporation: Experimental evaluation of liquid pumping and vapor compression cooling systems [PDF]
This paper was presented at the 3rd Micro and Nano Flows Conference (MNF2011), which was held at the Makedonia Palace Hotel, Thessaloniki in Greece.
Marcinichen, JB +2 more
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Air flow management inside data centres [PDF]
A data centre can be defined as an infrastructure facility that houses file servers, processors and other computer equipment, along with a standby power supply. These servers are kept inside cabinets and those cabinets are called racks.
Almoli, Ali Mubarak
core +6 more sources
Sensitivity Studies of a Low Temperature Low Approach Direct Cooling Tower for Building Radiant Cooling Systems [PDF]
Recent interest in cooling towers as a mechanism for producing chilled water, together with the evolution of radiant cooling, have prompted a review of evaporative cooling in temperate maritime climates.
Nasrabadi, Mehdi +3 more
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Technological Drivers in Data Centers and Telecom Systems: Multiscale Thermal, Electrical, and Energy Management [PDF]
including thermal, electrical and energy management challenges, based on discussions at the 2nd Workshop on Thermal Management in Telecommunication Systems and Data Centers in Santa Clara, California, on April 25–26, 2012.
Yeh, L.-T. +3 more
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Mini Vapour Cycle System For High Density Electronic Cooling Applications [PDF]
This paper reports the preliminary experimental results of a mini Vapour Cycle System (VCS) for electronic thermal management applications. The water cooled miniature scale refrigeration system uses R134a as working fluid and implements a new concept oil-
Mancin, Simone +2 more
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Optimisation of Continuous and Pulsed Cooling in Injection Moulding Processes [PDF]
The concept of pulsed cooling in injection moulding involves cycling the flow of coolant in order that cooling only takes place as and when it is required, as opposed to continuous cooling, where the coolant in run through the channels throughout the ...
B. A. McCalla +14 more
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Inthis present study, free convection from an in-line 5x1 array of aluminum foamheat sinks which were placed on the bottom wall of the inclined rectangularchannel was investigated.
Ayla Doğan, Oğuzhan Özbalcı
doaj +1 more source
Elastomeric composites are an important class of thermal interface materials as they are shape‐adaptive, which can fit uneven interfaces and achieve ideal interfacial heat transfer in electronic cooling.
Qiangqiang Ma +6 more
doaj +1 more source
Cooling of electronic system: from electronic chips to data centers
In this work, the physical problems associated with heat removal of electronic systems at different scales were studied. Various electronic cooling system designs and specific cooling techniques to improve performance were discussed.
Zhang, Jingru, 1984-
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Recently, thanks to the technological advances, electronic devices are getting smaller in size. This causes an increase in the heat generation per unit area.
Burcu Çiçek
doaj +1 more source

