Results 11 to 20 of about 106,467 (309)

Numerical Assessment of Heat Transfer and Entropy Generation of a Porous Metal Heat Sink for Electronic Cooling Applications

open access: yesEnergies, 2020
In the present study, the thermal performance of an electronic equipment cooling system is investigated. The heat sink used in the current cooling system consists of a porous channel with a rectangular cross-section that is assumed to be connected ...
Hamed Rasam   +3 more
doaj   +1 more source

A review of the state-of-the-art in electronic cooling

open access: yese-Prime: Advances in Electrical Engineering, Electronics and Energy, 2021
The cooling or thermal management issues are facing critical challenges with the continuous miniaturization and rapid increase of heat flux of electronic devices.
Zhihao Zhang, Xuehui Wang, Yuying Yan
doaj   +1 more source

Heat Transfer in Electronic Systems Printed Circuit Board: A Review [PDF]

open access: yesEngineering and Technology Journal, 2022
Thermal regulation has now become a staple in the design of electronic devices. As a result of technological advances in the electronic industry, component miniaturization and thermal system management are becoming more and more important.
Mustafa Kadum   +2 more
doaj   +1 more source

Impact of Microgroove Shape on Flat Miniature Heat Pipe Efficiency

open access: yesEntropy, 2018
Miniature heat pipes are considered to be an innovative solution able to dissipate high heat with low working fluid fill charge, provide automatic temperature control, and operate with minimum energy consumption and low noise levels.
François Ternet   +2 more
doaj   +1 more source

Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System

open access: yesEnergies, 2019
In order to better release the heat generated by the electronic components, a novel heat dissipation system is proposed, which combines a microchannel heat pipe (MHP) with a high thermal conductivity and a radiative plate with a high emissivity at ...
Cairui Yu   +8 more
doaj   +1 more source

Modulating Surface Chemistry of Al Powders for Elastomeric Composites with Applications in Electronic Cooling

open access: yesAdvanced Materials Interfaces, 2023
Elastomeric composites are an important class of thermal interface materials as they are shape‐adaptive, which can fit uneven interfaces and achieve ideal interfacial heat transfer in electronic cooling.
Qiangqiang Ma   +6 more
doaj   +1 more source

Electron cooling experiments in CSR [PDF]

open access: yesScience China Physics, Mechanics and Astronomy, 2011
5 pages 11 ...
XiaoDong Yang   +10 more
openaire   +2 more sources

Experimental Investigation of Free Convection from Foam Heat Sinks in an Inclined Rectangular Channel

open access: yesCumhuriyet Science Journal, 2018
Inthis present study, free convection from an in-line 5x1 array of aluminum foamheat sinks which were placed on the bottom wall of the inclined rectangularchannel was investigated.
Ayla Doğan, Oğuzhan Özbalcı
doaj   +1 more source

An Electronic Control Unit for Thermoelectric Cooling [PDF]

open access: yes, 2019
2019 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering, ElConRus 2019 -- 28 January 2019 through 30 January 2019 -- -- 145781Due to their efficient operation in small volumes, Thermoelectric Coolers (TECs) have a wide ...
Yavuz, Erdem   +5 more
core   +1 more source

Energy-Efficient Thermal Management of Periodic Electronic Cavities Using the Cascaded Lattice Boltzmann Method: Optimization of the Air Inlet Inclination [PDF]

open access: yesEPJ Web of Conferences
Efficient thermal management remains a major challenge in compact electronic systems, where increasing power density and confined geometries exacerbate heat accumulation and non-uniform temperature fields.
Amine Fatima Zahra Laktaoui   +7 more
doaj   +1 more source

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