Results 21 to 30 of about 106,467 (309)
Cooling of electronic system: from electronic chips to data centers
, 2012 In this work, the physical problems associated with heat removal of electronic systems at different scales were studied. Various electronic cooling system designs and specific cooling techniques to improve performance were discussed.
Zhang, Jingru, 1984-
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Sensors, 2020 This paper describes an experimental study of the cooling capabilities of microchannel and micro-pin-fin based on-chip cooling systems. The on-chip cooling systems integrated with a micro heat sink, simulated power IC (integrated circuit) and temperature
Yunlong Qiu +3 more
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The Reduction Design for Structure Borne Noise of Electronic Cabinet on Shipboard Considering Cooling Performance [PDF]
한국정밀공학회지, 2017 An air cooling system using an axial flow fan is generally applied in an electronic cabinet on shipboard. However, cases that apply a water cooling system or a mixture of water cooling and an air cooling system are gradually increased by applying the ...
Young Min Lee +4 more
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Case Studies in Thermal Engineering, 2023 A novel relaxation drift model (RDM) was proposed to simulate the interphase momentum non-equilibrium (slip) inside two-phase work-recovery CO2 ejectors.
Junan Long +5 more
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Cooling and Diffusion Rates in Coherent Electron Cooling Concepts
, 2021 Proceedings of the 12th International Particle Accelerator Conference, IPAC2021, Campinas, SP ...
Nagaitsev, Sergei +4 more
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Dynamical backaction cooling with free electrons [PDF]
Nature Communications, 2015 AbstractThe ability to cool single ions, atomic ensembles, and more recently macroscopic degrees of freedom down to the quantum ground state has generated considerable progress and perspectives in fundamental and technological science. These major advances have been essentially obtained by coupling mechanical motion to a resonant electromagnetic degree
Nigues, A., Siria, A., Verlot, Pierre
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Heat-Dissipation Performance of Nanocomposite Phase-Change Materials in a Twin-Heat-Source System
Fluids, 2020 In this paper, pure paraffin was mixed with CuO (high thermal conductivity) and Span-80 (as a dispersant). The CuO/paraffin nanocomposite phase-change materials (PCMs) were synthesized with mass fractions of 0.3%, 0.6%, and 1.2%, by a two-step method ...
Yanxin Li +3 more
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, 2013 including thermal, electrical and energy management challenges, based on discussions at the 2nd Workshop on Thermal Management in Telecommunication Systems and Data Centers in Santa Clara, California, on April 25–26, 2012.
Yeh, L.-T. +3 more
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Gazi Üniversitesi Fen Bilimleri DergisiRecently, thanks to the technological advances, electronic devices are getting smaller in size. This causes an increase in the heat generation per unit area.
Burcu Çiçek
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A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress
Inventions, 2017 This study provides an overview regarding enhancement of an air-cooled heat sink applicable for electronic cooling subject to cross-flow forced convection.
Chi-Chuan Wang
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