Results 1 to 10 of about 106,467 (309)
Novel cooling strategy for electronic packages: Directly injected cooling [PDF]
CIRP Journal of Manufacturing Science and Technology, 2009 This publication describes the development of a novel cooling strategy for electronic packages. During the conceptual design phase, the engineering disciplines involved are considered simultaneously. Through a case study, it is demonstrated that this integrative approach is an effective methodology leading to an innovative design. A novel, improved and
Wits, Wessel Willems +3 more
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ELECTRONIC CIRCUIT BOARDS NON-UNIFORM COOLING SYSTEM MODEL
Вестник Дагестанского государственного технического университета: Технические науки, 2016 . The paper considers a mathematical model of non-uniform cooling of electronic circuit boards. The block diagram of the system implementing this approach, the method of calculation of the electronic board temperature field, as well as the principle of ...
D. V. Yevdulov, O. V. Yevdulov
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DEVICES FOR COOLING ELECTRONIC CIRCUIT BOARDS
Вестник Дагестанского государственного технического университета: Технические науки, 2016 In the work described structural variants of devices for cooling electronic circuit boards, made on the basis of thermoelectric batteries and consumable working substances, implementing uneven process of removing heat from heat-generating components.
T. A. Ismailov +3 more
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Cooling Performance of Heat Sinks Used in Electronic Devices
MATEC Web of Conferences, 2018 Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions.
Mjallal Ibrahim +5 more
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Analysis of Thermal and Flow Characteristics in a Combined Cross-Flow and Jet-Flow Configuration with Flow-Guiding Fins [PDF]
Journal of Applied Fluid Mechanics, 2022 This study investigated the enhanced cooling of electronic components at high temperatures with cross-flow and jet-flow combinations. The cooling performance of four different model geometries (Models 1, 2, 3, and 4) of an electronic component was ...
M. S. Ozturk, T. Demircan
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Engineering, 2023 The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single
Srikanth Rangarajan +2 more
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Energies, 2023 This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems.
Yijun Li +4 more
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Electronic Cooling in Graphene [PDF]
Physical Review Letters, 2009 corrected typos and added ...
Bistritzer, R., MacDonald, A. H.
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Coherent Electron Cooling [PDF]
Physical Review Letters, 2009 Cooling intense high-energy hadron beams poses a major challenge for modern accelerator physics. The synchrotron radiation emitted from such beams is feeble; even in the Large Hadron Collider (LHC) operating with 7 TeV protons, the longitudinal damping time is about 13 hours.
Vladimir N, Litvinenko +1 more
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Parametric Study of Electronic Cooling by Means of a Combination of Crossflow and an Impinging Jet
IEEE Access, 2022 This paper reports a parametric study’s experimental results based on the experiments’ design. No works in the literature have investigated parametrically experimental effects on electronic component cooling by combining an impinging jet ...
Yunesky Masip Macia +3 more
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