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A review of the state-of-the-art in electronic cooling
e-Prime: Advances in Electrical Engineering, Electronics and Energy, 2021 The cooling or thermal management issues are facing critical challenges with the continuous miniaturization and rapid increase of heat flux of electronic devices.
Zhihao Zhang, Xuehui Wang, Yuying Yan
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Analysis of Thermal and Flow Characteristics in a Combined Cross-Flow and Jet-Flow Configuration with Flow-Guiding Fins [PDF]
Journal of Applied Fluid Mechanics, 2022 This study investigated the enhanced cooling of electronic components at high temperatures with cross-flow and jet-flow combinations. The cooling performance of four different model geometries (Models 1, 2, 3, and 4) of an electronic component was ...
M. S. Ozturk, T. Demircan
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Engineering, 2023 The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single
Srikanth Rangarajan +2 more
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Energies, 2023 This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems.
Yijun Li +4 more
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Thermal analysis of PCM-based hybrid micro-channel heat sinks A numerical study
Journal of Thermal Engineering, 2023 Heat sinks play a vital part in the heat dissipation in electronic devices and energy systems. Heat generation in the present-time electronic equipment is very high because of the high power density and the miniaturization of the components. An efficient
Korasikha Naga RAMESH +1 more
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Parametric Study of Electronic Cooling by Means of a Combination of Crossflow and an Impinging Jet
IEEE Access, 2022 This paper reports a parametric study’s experimental results based on the experiments’ design. No works in the literature have investigated parametrically experimental effects on electronic component cooling by combining an impinging jet ...
Yunesky Masip Macia +3 more
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Energies, 2020 In the present study, the thermal performance of an electronic equipment cooling system is investigated. The heat sink used in the current cooling system consists of a porous channel with a rectangular cross-section that is assumed to be connected ...
Hamed Rasam +3 more
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Impact of Microgroove Shape on Flat Miniature Heat Pipe Efficiency
Entropy, 2018 Miniature heat pipes are considered to be an innovative solution able to dissipate high heat with low working fluid fill charge, provide automatic temperature control, and operate with minimum energy consumption and low noise levels.
François Ternet +2 more
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Heat Transfer in Electronic Systems Printed Circuit Board: A Review [PDF]
Engineering and Technology Journal, 2022 Thermal regulation has now become a staple in the design of electronic devices. As a result of technological advances in the electronic industry, component miniaturization and thermal system management are becoming more and more important.
Mustafa Kadum +2 more
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Numerical and Experimental Study on the Heat Dissipation Performance of a Novel System
Energies, 2019 In order to better release the heat generated by the electronic components, a novel heat dissipation system is proposed, which combines a microchannel heat pipe (MHP) with a high thermal conductivity and a radiative plate with a high emissivity at ...
Cairui Yu +8 more
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