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A review of the state-of-the-art in electronic cooling
e-Prime: Advances in Electrical Engineering, Electronics and Energy, 2021 The cooling or thermal management issues are facing critical challenges with the continuous miniaturization and rapid increase of heat flux of electronic devices.
Zhihao Zhang, Xuehui Wang, Yuying Yan
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Analysis of Thermal and Flow Characteristics in a Combined Cross-Flow and Jet-Flow Configuration with Flow-Guiding Fins [PDF]
Journal of Applied Fluid Mechanics, 2022 This study investigated the enhanced cooling of electronic components at high temperatures with cross-flow and jet-flow combinations. The cooling performance of four different model geometries (Models 1, 2, 3, and 4) of an electronic component was ...
M. S. Ozturk, T. Demircan
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Engineering, 2023 The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single
Srikanth Rangarajan +2 more
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Electronic Cooling in Graphene [PDF]
Physical Review Letters, 2009 corrected typos and added ...
Bistritzer, R., MacDonald, A. H.
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Energies, 2023 This paper presents a detailed literature review on the thermal management issue faced by electronic devices, particularly concerning uneven heating and overheating problems.
Yijun Li +4 more
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Coherent Electron Cooling [PDF]
Physical Review Letters, 2009 Cooling intense high-energy hadron beams poses a major challenge for modern accelerator physics. The synchrotron radiation emitted from such beams is feeble; even in the Large Hadron Collider (LHC) operating with 7 TeV protons, the longitudinal damping time is about 13 hours.
Vladimir N, Litvinenko +1 more
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Thermal analysis of PCM-based hybrid micro-channel heat sinks A numerical study
Journal of Thermal Engineering, 2023 Heat sinks play a vital part in the heat dissipation in electronic devices and energy systems. Heat generation in the present-time electronic equipment is very high because of the high power density and the miniaturization of the components. An efficient
Korasikha Naga RAMESH +1 more
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Parametric Study of Electronic Cooling by Means of a Combination of Crossflow and an Impinging Jet
IEEE Access, 2022 This paper reports a parametric study’s experimental results based on the experiments’ design. No works in the literature have investigated parametrically experimental effects on electronic component cooling by combining an impinging jet ...
Yunesky Masip Macia +3 more
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Energies, 2020 In the present study, the thermal performance of an electronic equipment cooling system is investigated. The heat sink used in the current cooling system consists of a porous channel with a rectangular cross-section that is assumed to be connected ...
Hamed Rasam +3 more
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ELECTRONIC CIRCUIT BOARDS NON-UNIFORM COOLING SYSTEM MODEL
Вестник Дагестанского государственного технического университета: Технические науки, 2016 . The paper considers a mathematical model of non-uniform cooling of electronic circuit boards. The block diagram of the system implementing this approach, the method of calculation of the electronic board temperature field, as well as the principle of ...
D. V. Yevdulov, O. V. Yevdulov
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