Results 131 to 140 of about 1,376,022 (258)

Author Correction: Development and testing of an open source mobile application for audiometry test result analysis and diagnosis support. [PDF]

Sci Rep
Kassjański M, Kulawiak M, Przewoźny T, Tretiakow D, Molisz A.   +4 more
europepmc   +1 more source

An Examination of Aerosol Jet‐Printed Surface Roughness and its Impact on the Performance of High‐Frequency Electronics

Advanced Engineering Materials, EarlyView.
This study explores aerosol jet‐printed (AJP) surface roughness, its effects on the performance of microwave electronics, and its process contributors. First, an electromagnetic model is vetted for AJP's unique roughness signature. Simulations are built which show process‐induced roughness is as significant as conductor resistivity in driving microwave
Christopher Areias, Alkim Akyurtlu
wiley   +1 more source

Integrating Hard Silicon for High-Performance Soft Electronics via Geometry Engineering. [PDF]

Nanomicro Lett
Yan L, Liu Z, Wang J, Yu L.
europepmc   +1 more source

Influence of an Al‐Doped ZnO Interface Layer on the Thermochromic Properties of VO2 Thin Films Deposited by RF Magnetron Sputtering

Advanced Engineering Materials, EarlyView.
Herein the metal‐to‐insulator transition is investigated when depositing vanadium dioxide (VO2) on glass or aluminum‐doped zinc oxide (AZO). O2 flow tuning during the deposition and additional post annealing are effective to control the metal‐to‐insulator transition. However, the VO2/AZO/glass stack reveals an increase in the transition temperature and
Eduard Llorens Balada, Evgeniy Shkondin, Stela Canulescu, Eugen Stamate   +3 more
wiley   +1 more source

Recent advancements in wearable sensors: integration with machine learning for human-machine interaction. [PDF]

RSC Adv
Mu G, Zhang Y, Yan Z, Yu Q, Wang Q.
europepmc   +1 more source

Investigation of Solid‐Solution Phase Formation in AlCuNiSi Medium Entropy Alloys and its Effect on Microstructural, Thermal, and Microhardness Properties

Advanced Engineering Materials, EarlyView.
This study focuses on synthesizing equiatomic AlCuNiSi medium‐entropy alloys using mechanical alloying for advanced industrial applications. Continuous milling leads to grain refinement and the formation of stable BCC/FCC solid‐solution phases, resulting in enhanced mechanical properties. A unique Si‐rich solid‐solution phase is observed, which did not
Mustafa Okumuş, Mehmet Emin Demir, Celal Onat   +2 more
wiley   +1 more source

Recent Advances in Paper-Based Electronics: Emphasis on Field-Effect Transistors and Sensors. [PDF]

Biosensors (Basel)
Barmpakos D, Apostolakis A, Jaber F, Aidinis K, Kaltsas G.   +4 more
europepmc   +1 more source

A Study on Thermal Expansion and Thermomechanical Behavior of Composite Metal Foams

Advanced Engineering Materials, EarlyView.
The coefficient of thermal expansion of steel–steel composite metal foam (S‐S CMF) is shown to be lower than that of bulk stainless steel while its performance under compression demonstrate excellent mechanical stability and strength at all temperatures with gradualsoftening from 400 to 600 °C.
Zubin Chacko, Nigel Amoafo Yeboah, Afsaneh Rabiei   +2 more
wiley   +1 more source

Laser-Enabled Fabrication of Flexible Printed Electronics with Integrated Functional Devices. [PDF]

Adv Sci (Weinh)
Babatain W, Park C, Ishii H, Gershenfeld N.   +3 more
europepmc   +1 more source

Impacts of Device Geometry and Layout on Temperature Profile during Large‐Area Photonic Curing

Advanced Engineering Materials, EarlyView.
The study investigates how gate geometry affects peak curing temperature during photonic curing of solution‐processed indium zinc oxide thin‐film transistors. Using 3D simulations and experimental validation, it reveals that larger gate areas and smaller aspect ratios increase curing temperature and thus improve transistor performance. Findings provide
Yasir Fatha Abed, Neel Chatterjee, Bing Luo, Sarah L. Swisher   +3 more
wiley   +1 more source