Results 181 to 190 of about 1,973,963 (357)
Advanced Engineering Materials, EarlyView.This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan +5 more
wiley +1 more source
Advanced Engineering Materials, EarlyView.This study investigates the influence of ceramic fillers—aluminum oxide, boron nitride, and a combination of aluminum oxide and zinc oxide—with different particle sizes, on the thermal conductivity of solid silicone rubber. Additionally, the impact of potential synergistic interactions from the simultaneous addition of selected fillers is explored to ...
Aryan Oktaee +3 more
wiley +1 more source
Transient electronics for sustainability: Emerging technologies and future directions. [PDF]
Beilstein J NanotechnolBae JY, Choi MK, Kang SK.
europepmc +1 more source
China and the Future of Asian Electronics Trade [PDF]
China’s emergence as a key player in the global electronics industry has ignited concerns among its East Asian neighbors. Upper and middle-income economies fear that China’s rise is hollowing out their electronics industrial base.
Ari Van Assche, Byron Gangnes
core
Advanced Engineering Materials, EarlyView.Scanning transmission electron microscopy imaging techniques are an essential tool to document dynamic developments, such as precipitation in aluminum alloys, during in situ heating experiments using transmission electron microscopy. However, in many cases, chemical information is required to interpret complex nanoscale processes.
Evelin Fisslthaler +4 more
wiley +1 more source
Plasmonic photothermal printing of all-metal-oxide electronics. [PDF]
Light Sci ApplMazur E.
europepmc +1 more source
A compact, economical core memory with all-monolithic electronics [PDF]
, 1968 Robert W. Reichard, William F. Jordan
openalex +1 more source