Results 191 to 200 of about 1,973,963 (357)

The Effect of Thickness, Build Orientation, and Loading Rate on the Tensile and Compressive Properties of Selective Laser Sintering Polyamide 12 Specimens

Advanced Engineering Materials, EarlyView.
This article examines how build orientation, thickness, and loading rate affect the tensile and compressive properties of LS‐manufactured polyamide 12 12 parts. Through over 120 experiments, it reveals strong ductility anisotropy in tension, minimal compressive sensitivity, and significant thickness and strain rate dependencies.
Andreas Psarros, Grigorios Paraskevopoulos, Georgios Savaidis   +2 more
wiley   +1 more source

Radical-enhanced photo-activated ultralong organic phosphorescence. [PDF]

Nat Commun
Wang Y, Zhang Z, Yang H, Li S, Yao X, Ma H, Yang S, Cai S, An Z, Huang W.   +9 more
europepmc   +1 more source

Microstructural Evolution and Mechanical Property Degradation of Sn0.5Ag0.7Cu5Bi Solder Joints with High Indium Alloying

Advanced Engineering Materials, EarlyView.
This study identifies 12 wt% indium (In) as the optimal composition for Sn0.5Ag0.7Cu5Bi solder joints, achieving 87% ductile fracture and 81% suppression of intermetallic compound (IMC) growth versus 4 wt% In. High‐In alloys (15–17 wt%) show abnormal IMC thickening due to thermal activation.
Liuwei Wang, Huidong Gu, Xiaojing Wang, Shanshan Cai, Saad Alshammari, Gaber A. M. Mersal, Yanlai Wang, Xulei Wu, Hanhui Lei, Juanna Ren, Mohamed M. Ibrahim, Terence X. Liu   +11 more
wiley   +1 more source

On-Skin Epidermal Electronics for Next-Generation Health Management. [PDF]

Nanomicro Lett
Xu J, Chen X, Li S, Luo Y, Deng S, Yang B, Lv J, Tian H, Li X, Shao J.   +9 more
europepmc   +1 more source

Radio and Electronics Engineering [PDF]

, 1960

openalex   +1 more source

Microscale 3D Printed Pillars and Porous Polymeric Structures: Manufacturability and Micromechanics

Advanced Engineering Materials, EarlyView.
This work demonstrates how two‐photon polymerization enables the fabrication of microscale solid and porous structures from IP‐Q, IP‐S, and IP‐PDMS resins. Combining morphological and mechanical characterization, the study provides the first systematic insights into IP‐Q mechanics and reveals how processing parameters affect structure and stiffness ...
Aikaterini Isaakidou, Mahya Ganjian, Vahid Moosabeiki, Marius Alexander Leeflang, Mahdiyeh Nouri Goushki, Pouyan Esmailzadeh Boukany, Maria Wątroba, Alexander Groetsch, Jakob Schwiedrzik, Mohammad Javad Mirzaali, Iulian Apachitei, Lidy Elena Fratila‐Apachitei, Amir Abbas Zadpoor   +12 more
wiley   +1 more source

Semiconductor manufacturing wastewater challenges and the potential solutions via printed electronics. [PDF]

iScience
Sandhu S, Zumeit A, Tian Z, Vinciguerra V, Dahiya R.   +4 more
europepmc   +1 more source

Progress in Physical Electronics [PDF]

, 1962
J. R. TILLMAN
openalex   +1 more source

Large Area, Cost‐Effective, and Ultra‐Fast Fabrication of Mini‐Coils Toward Noninvasive Magnetic Applications

Advanced Engineering Materials, EarlyView.
A simple, cleanroom‐free method produces flexible mini‐coils using automated blade cutting. The process is fast, low‐cost, and supports diverse materials. The coils show strong durability and performance under repeated bending. Demonstrated use in resistor‐inductor filters and magnetic nanoparticle control proves their adaptability.
Changhao Ge, Bhavani Prasad Yalagala, Tahereh Masalehdan, Mahdieh Shojaei Baghini, Danijela Gregurec, Hadi Heidari   +5 more
wiley   +1 more source

Correction: Post-Quantum enhanced Ascon for secure vehicular IoT data integrity. [PDF]

Sci Rep
Bhuvaneshwari AJ, Kaythry P, Kishore R, MuthuHarish R.   +3 more
europepmc   +1 more source