Results 211 to 220 of about 1,973,963 (357)
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke +3 more
wiley +1 more source
Pulsed laser-assisted direct fabrication of Mo<sub>x</sub>W<sub>1-x</sub>S<sub>2</sub> alloy-based flexible strain sensors with superior performance for high-temperature applications. [PDF]
Wang K +9 more
europepmc +1 more source
EXPANSION OF INTEGRATED ELECTRONICS PROGRAMS CREATES NEW OPENINGS FOR TOP LEVEL SCIENTISTS AND ENGINEERS AT DELCO RADIO [PDF]
openalex +1 more source
Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli
A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley +1 more source
Polymer Micro/Nanofabrication and Manufacturing II. [PDF]
Juang YJ.
europepmc +1 more source
Bioinspired Materials, Designs, and Manufacturing Strategies for Advanced Impact‐Resistant Helmets
This review explores how bioinspired materials, structures, and manufacturing strategies transform helmet design to achieve enhanced impact resistance. Drawing inspiration from nacre, porcupine quills, beetle exoskeletons, and skull architectures, it highlights advances in auxetic lattices, nanocomposites, and functionally graded foams.
Joseph Schlager +4 more
wiley +1 more source
All 2D Material Printed Diodes and Circuits on Paper for Sustainable Electronics. [PDF]
Grillo A +8 more
europepmc +1 more source
David Sarnoff Award in Electronics: Dr. C. H. Townes [PDF]
D. H. R. Barton +5 more
openalex +1 more source

