Results 31 to 40 of about 675,557 (217)

Control of Vibratory Feeder Device Mechanical Frequency Using the Modification of the Sinusoidal Supply Voltage Signal

Journal of Low Power Electronics and Applications
In the industrial and sales processes, dosing systems of various constructions, whose operation is based on mechanical vibrations (vibratory feeders), are very often used.
Žydrūnas Kavaliauskas, Igor Šajev
doaj   +1 more source

Modeling and Experimental Validation of the Intrinsic SNR in Spin Qubit Gate-Based Readout and Its Impacts on Readout Electronics

IEEE Transactions on Quantum Engineering
In semiconductor spin quantum bits (qubits), the radio-frequency (RF) gate-based readout is a promising solution for future large-scale integration, as it allows for a fast, frequency-multiplexed readout architecture, enabling multiple qubits to be read ...
Bagas Prabowo, Jurgen Dijkema, Xiao Xue, Fabio Sebastiano, Lieven M. K. Vandersypen, Masoud Babaie   +5 more
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WSe2 2D p‐type semiconductor‐based electronic devices for information technology: Design, preparation, and applications

InfoMat, 2020
The pioneering exfoliation of monolayer tungsten diselenide has greatly inspired researchers toward semiconducting applications. WSe2 belongs to a family of transition‐metal dichalcogenides.
Qilin Cheng, Jinbo Pang, Dehui Sun, Jingang Wang, Shu Zhang, Fan Liu, Yuke Chen, Ruiqi Yang, Na Liang, Xiheng Lu, Yanchen Ji, Jian Wang, Congcong Zhang, Yuanhua Sang, Hong Liu, Weijia Zhou   +15 more
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Advanced Photonic and Electronic Systems WILGA 2018 [PDF]

International Journal of Electronics and Telecommunications, 2018
WILGA annual symposium on advanced photonic and electronic systems has been organized by young scientist for young scientists since two decades. It traditionally gathers around 400 young researchers and their tutors.
Ryszard S. Romaniuk
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Physical-topology modeling of silicon/gallium arsenide Schottky transistor of submicron technology LSI

Фізика і хімія твердого тіла, 2020
In this paper described researched essentials and physical mechanisms of MESFET on epitaxy layers of GaAs with monocrystalline silicon wafer. Conducted computer modeling of MESFET with p-channel: distributions of potential, volumetric charge, current in ...
S. P. Novosyadliy, V. M. Lukovkin, R. Melnyk, A. V. Pavlyshyn   +3 more
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Electrons in Glass [PDF]

Science, 1975
An outline is given of some of the steps which in the last ten years have led to an understanding of many of the properties of conduction and valence bands in non-crystalline materials. The concept of a mobility edge is described and some of the experimental evidence for its existence.
openaire   +7 more sources

Aerosol Jet Printing of a Benzocyclobutene‐Based Ink as Adhesive Material for Wafer Bonding Application

Advanced Materials Interfaces, 2023
Aerosol jet printing (AJP) is an emerging additive manufacturing technology that is gaining increasing attention in the electronic field. Several studies have been carried out on the AJP of conductive, semiconductive, and dielectric polymers for ...
Filippo Iervolino, Angelica Baldini, Ilaria Gelmi, Laura Castoldi, Raffaella Suriano, Marinella Levi   +5 more
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Adaptation of a Real-Time Deep Learning Approach With an Analog Fault Detection Technique for Reliability Forecasting of Capacitor Banks Used in Mobile Vehicles

IEEE Access, 2022
The DC-Link capacitor is defined as the essential electronics element which sources or sinks the respective currents. The reliability of DC-link capacitor-banks (CBs) encounters many challenges due to their usage in electric vehicles.
Mohammad A. Rezaei, Arman Fathollahi, Sajad Rezaei, Jiefeng Hu, Meysam Gheisarnejad, Ali Reza Teimouri, Rituraj Rituraj, Amir H. Mosavi, Mohammad-Hassan Khooban   +8 more
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Application of Biodegradable and Biocompatible Nanocomposites in Electronics: Current Status and Future Directions

Nanomaterials, 2019
With the continuous increase in the production of electronic devices, large amounts of electronic waste (E-waste) are routinely being discarded into the environment.
Haichao Liu, Ranran Jian, Hongbo Chen, Xiaolong Tian, Changlong Sun, Jing Zhu, Zhaogang Yang, Jingyao Sun, Chuansheng Wang   +8 more
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Liquid metal phase change materials for thermal management of electronics

Advances in Physics: X
With the rapid development of various chips towards high performance and integration, the ‘thermal barrier’ difficulty facing electronic devices has become ever increasingly challenging, while at the same time the space size left for thermal management ...
Yuchen Yao, Wei Li, Jing Liu, Zhongshan Deng   +3 more
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