Results 101 to 110 of about 197,562 (202)

Thermal management of 3-D heterogeneously integrated microelectronics: challenges and future research directions. [PDF]

Commun Eng
Sharma MK, Ramos-Alvarado B.
europepmc   +1 more source

Stimulation Modalities in Wearable Haptic Systems: Single-Mode Feedback to Multiphysics Actuation. [PDF]

Research (Wash D C)
Guo X, Avila R, Wu Z, Wang X, Xu P, Ju P, Yang Q, Liu P, Choi S, Andrei N, Xie Z.   +10 more
europepmc   +1 more source

Fusion of NSGA-II and Latin hypercube sampling for optimizing node displacement in thin-film IME molding. [PDF]

Sci Rep
Chang H, Long F, Li J.
europepmc   +1 more source

Electronic Cooling Machining

Transactions of the Japan Society of Mechanical Engineers, 1967
Keiji OKUSHIMA, Katsundo HITOMI, Kyoji KAWAMOTO, Yasushi MURAKAMI   +3 more
openaire   +2 more sources

A review on flexible self-healing thermoelectric devices. [PDF]

iScience
Sun X, Hou Y, Wang Z, Yu Y.
europepmc   +1 more source

Hierarchical Manufacturing of Anisotropic and High-Efficiency Electromagnetic Interference Shielding Modules for Smart Electronics. [PDF]

Nanomicro Lett
Shi S, Deng S, Jiang Y, Chen J, Sporrer L, Cheng F, Guo Q, Jing J, Chen Y.   +8 more
europepmc   +1 more source

Foehn: An open-hardware asynchronous scheduling hub for high-throughput liquid-handling workflow. [PDF]

HardwareX
Gao Y, Danks J, Dawes S, Besenhard MO.
europepmc   +1 more source

Beyond Conventional Cooling: Advanced Micro/Nanostructures for Managing Extreme Heat Flux. [PDF]

Adv Mater
Zhang Y, Li H, Zhou Y, Ma J, Lin KT, Lin H, Guo C, Jia B.   +7 more
europepmc   +1 more source

Scalable Mie-Silk textile for dual-mode personal cooling indoors and outdoors. [PDF]

Sci Adv
Wang Y, Wu XE, Lu H, Qi L, Zhou Y, Wu S, Jin J, Li D, Bi P, Zou M, Lin S, Liang H, Zhu M, Gan L, Fan W, Dai X, Zhang Y.   +16 more
europepmc   +1 more source

Ultrasonic Monitoring of the Processes of Blast Freezing and Thawing of Meat. [PDF]

Foods
Tatarinov A, Osipova M, Mironovs V.
europepmc   +1 more source