Results 181 to 190 of about 1,899,131 (352)
A ternary Li<sub>3</sub>B<sub>7</sub>Si<sub>3</sub> cluster: when reduced electron delocalization enhances thermodynamic stability. [PDF]
RSC AdvDuong LV +4 more
europepmc +1 more source
Advanced Engineering Materials, EarlyView.This study presents a 3D representative volume element‐based simulation approach to predict mesoscopic residual stress and strain fields in silicon solid solution‐strengthened ductile cast iron. By modeling phase transformation kinetics with an enhanced Johnson–Mehl–Avrami–Kolmogorov model, the effects of varying cooling rates on residual stresses are ...
Lutz Horbach +6 more
wiley +1 more source
Optical phonon confinement significantly lowers the hot electron energy loss rate in III-nitride (InN, GaN, and AlN) and GaAs nanoscale structures. [PDF]
Nanoscale AdvThi Phuong Thuy H, Hien ND.
europepmc +1 more source
THE FINE STRUCTURE OF THE INTERSTITIAL CELL IN THE MOUSE OVARY STUDIED WITH ELECTRON MICROSCOPE
, 1958 TOYOKO MUTA
openalex +2 more sources
Advanced Engineering Materials, EarlyView.A new experimental setup, incorporating digital image correlation and infrared thermography in combination with inductive‐conductive heating for precise temperature control, is used to analyze the mechanical behavior and microstructural changes of sheet metal under complex thermomechanical test conditions that represent quench and partitioning ...
Christian Illgen +4 more
wiley +1 more source
A Metrological Near-Room-Temperature Photon-Number-Resolving Detector: A Design Study. [PDF]
Sensors (Basel)Levine ZH +3 more
europepmc +1 more source
Electron Microscopic Evidence on the Structure of the Particles of Tobacco Rattle Virus582
, 1959 H. L. Nixon, B. D. Harrison
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Advanced Engineering Materials, EarlyView.This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan +5 more
wiley +1 more source