Results 211 to 220 of about 12,346,737 (289)

Kesterite-based optoelectronic synaptic memristors: a mini-review on material design and neuromorphic application. [PDF]

Sci Technol Adv Mater
Yang F, Sun H, Dong X, Zhang X, Chen J, Zhang X, Zhao Y, Li Y.   +7 more
europepmc   +1 more source

Advances in Se Wide‐Bandgap Photovoltaics and TexSe1‐x SWIR Photodiodes

Advanced Science, EarlyView.
In this review, fundamental properties and current challenges in Se photovoltaics (PVs) for tandem and indoor PVs and TexSe1‐x alloys for short wave infrared photodiodes are discussed. A case is made for the practicality of elemental chalcogenide optoelectronics, and a pathway toward resolving the key challenges in these respective technologies is ...
Adam D. Alfieri, Deep Jariwala
wiley   +1 more source

Dual Randomness From Spatial and Temporal Variations in Stochastic Zinc Gallate Nanoclusters for PUF and TRNG Co-Driven Image Generation. [PDF]

Adv Sci (Weinh)
Kang S, Choi W, Lee J, Kim YK, Jang BC, Shin W, Yoo H.   +6 more
europepmc   +1 more source

Lattice Chloride Shielding and Reconstructed Phosphate Armor for Stable Seawater Electrolysis

Advanced Science, EarlyView.
A dual‐protection strategy integrating lattice Cl shielding with dynamically reconstructed phosphate armor enables selective OH adsorption and suppresses chloride‐induced corrosion during alkaline seawater electrolysis, delivering durable operation at industrial‐level current densities.
Yatao Yan, Yuxing Lin, Xing Chen, Shuo Yang, Ke Zhou, Jifang Chen, Lubin Ni, Ming Chen   +7 more
wiley   +1 more source

Tracing Europe-Wide Copper and Bronze flow in the Dutch Late Neolithic to the Early Iron Age. [PDF]

PLoS One
Merkel SW, Arnoldussen S, Theunissen L, van Os B, van der Leije J, Brattinga J, Amkreutz L, Beekman B, Biezeveld I, Williams RA.   +9 more
europepmc   +1 more source

Wafer‐Scale 3D Integration for High‐Density Multi‐Valued Neuromorphic Logic

Advanced Science, EarlyView.
Wafer‐scale 3D vertically integrated multi‐valued logic (MVL) circuits are realized by monolithically integrating a Te/IGZO heterojunction FET with an engineered Te pull‐up FET. Heterointerface‐mediated transport and optimized current matching enable stable ternary operation, while vertical stacking reduces circuit footprint and interconnect complexity,
Chang‐Hyeon Kim, Min Seok Kim, Joong Bum Rhim, Tae In Kim, Hyuck‐In Kwon, Ick‐Joon Park   +5 more
wiley   +1 more source

Multimodal microscopic and spectroscopic characterisation of heterogeneous iron oxyhydroxides in the human globus pallidus. [PDF]

Biometals
Kopáni M, Kosnáč D, Gemeiner P, Hlinková J, Janega P, Pánik J, Polák Š.   +6 more
europepmc   +1 more source

Synthesis‐Dependent Grain Boundary Density Governs Low‐Temperature Lithium Diffusion in Single‐Crystal NCM Cathodes

Advanced Science, EarlyView.
The relationship between synthesis‐dependent crystallization behavior, internal grain‐boundary density, and intrinsic lithium diffusion kinetics in single‐crystal mid‐Ni NCM cathodes is elucidated, providing practical design insights for advanced cathode materials.
Yeong Beom Kim, Jaewon Lee, Jihong Park, Seunghyeon Chae, Dohyung Kim, Gigap Han, Hyeongi Song, Jihye Jang, Jihoon Choi, Sang Mun Jeong, Yun Chan Kang, Gi Dae Park   +11 more
wiley   +1 more source

A Superstrong and Ultratough Stretchable Electronic Conductor With Ultradurable Strain‐Insensitive Electromechanical Performance

Advanced Science, EarlyView.
We report a superstrong, ultratough, and fatigue‐resistant stretchable electronic conductor (SEC) integrating a viscoplastic quasi‐solid LM‐Ag alloy with a supramolecular elastomer. Unlike conventional LM, the alloy exhibits thixotropic flow, reduced surface tension, and enhanced interfacial interactions with the elastomer.
Yuxing Shan, Dong Lei, Chengzhi Huang, Chunhong Gong, Jingwei Zhang, Xiaokong Liu   +5 more
wiley   +1 more source

Bio-Inspired Internal Stress Engineering for Microscale Surface Cracking in Sensitive Strain Sensors. [PDF]

Adv Sci (Weinh)
Jang JY, Cho H, Jung Y.
europepmc   +1 more source