Results 161 to 170 of about 1,738,349 (311)
Hydrostatic bearings excel in high‐precision applications, but their performance hinges on a continuous external supply. This study evaluates various material combinations for sliding surfaces to mitigate damage during supply failures or misalignment and to discover the most effective materials identified for enhancing the reliability and efficiency of
Michal Michalec+6 more
wiley +1 more source
Beyond Order: Perspectives on Leveraging Machine Learning for Disordered Materials
This article explores how machine learning (ML) revolutionizes the study and design of disordered materials by uncovering hidden patterns, predicting properties, and optimizing multiscale structures. It highlights key advancements, including generative models, graph neural networks, and hybrid ML‐physics methods, addressing challenges like data ...
Hamidreza Yazdani Sarvestani+4 more
wiley +1 more source
Emergency egress requirements for Space Station Freedom [PDF]
There is a real concern regarding the requirements for safe emergency egress from the Space Station Freedom (SSF). The possible causes of emergency are depressurization due to breach of the station hull by space debris, meteoroids, seal failure, or vent ...
Ray, Paul S.
core +1 more source
Annals of Clinical and Translational Neurology, EarlyView.
Majid Khalilizad+4 more
wiley +1 more source
Ni‐base superalloys produced using additive manufacturing (AM) have a different response to heat treatments when compared to their conventional counterparts. Due to such unpredictability, various alloys with industrial interest are currently overlooked in most prior AM research.
Guilherme Maziero Volpato+6 more
wiley +1 more source
Recognising and understanding collective resilience in crowds of survivors [PDF]
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Amlot, Richard+6 more
core
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source