Results 221 to 230 of about 529,995 (306)

Design and Analysis of Compression–Torsion Coupling Metamaterials Using the Golden Section Method

Advanced Engineering Materials, EarlyView.
A novel compression–torsion metamaterial is engineered using inclined rods and symmetry breaking. To optimize its torsional performance, the golden section method is employed. The mechanical response of the metamaterial is validated through both numerical analysis and experimental validation.
Amirhossein Hassani, Sara Bagherifard
wiley   +1 more source

Active Corrosion Protection of Sintered AA7075 Aluminum Alloy via Mn Powder Addition

Advanced Engineering Materials, EarlyView.
AA7075 containing Mn‐rich particles is fabricated via spark plasma sintering using AA7075 and Mn powders. Corrosion resistance is evaluated through dip‐and‐dry tests using 0.1 M NaCl (pH 6.0), and mass loss decreases with increasing Mn addition. Mn‐rich particles function as a source of Mn ions, and formation of Mn‐accumulation films on Cu‐containing ...
Ko Ebina, Masashi Nishimoto, Izumi Muto
wiley   +1 more source

Microscopic measurement of the local deformation field establishes the mechanistic origin of the fatigue threshold for soft brittle materials.

Soft Matter
Altuntas U, Li C, Kolinski JM.
europepmc   +1 more source

All-optical doubly resonant cavities for energy-efficient ReLU function in nanophotonic deep learning. [PDF]

PLoS One
Ahmadnejad A, Asadi MM, Koohi S.
europepmc   +1 more source

Influence of Scan Strategies in Electron Beam Powder Bed Fusion on Solidification, Microstructure, and High‐Temperature Compressive Properties of γ′‐Strengthened Inconel 738LC

Advanced Engineering Materials, EarlyView.
Experiments and thermophysical simulations were conducted to investigate the electron beam powder bed fusion electron beam (PBF‐EB/M) process for the γ′‐strengthened nickel‐based superalloy Inconel 738LC. The results demonstrate the impact of process‐induced microstructural variations on high‐temperature mechanical behavior, providing a basis for ...
Jan Niklas Petenati, Karthik Kumar Banku, Prasanth Bondi, Ivan Zhirnov, Yangyiwei Yang, Gordon Schmidt, Jürgen Christen, Georg Hasemann, Manja Krüger, Bai‐Xiang Xu, Bilal Gökce, Silja‐Katharina Rittinghaus   +11 more
wiley   +1 more source

General inverse-cube thickness scaling of projectile penetration energy in ultrathin films. [PDF]

Proc Natl Acad Sci U S A
Zaccone A, Sirk TW.
europepmc   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source

An electrochemical hypothesis of earthquakes exploring a theoretical link between radiated seismic energy and Pourbaix potential. [PDF]

Sci Rep
Das A, Bag SP.
europepmc   +1 more source

Printed Integrated Logic Circuits Based on Chitosan‐Gated Organic Transistors for Future Edible Systems

Advanced Functional Materials, EarlyView.
Edible electronics needs integrated logic circuits for computation and control. This work presents a potentially edible printed chitosan‐gated transistor with a design optimized for integration in circuits. Its implementation in integrated logic gates and circuits operating at low voltage (0.7 V) is demonstrated, as well as the compatibility with an ...
Giulia Coco, Valerio Francesco Annese, Valerio Galli, Ilaria Penna, Debora Russo, Marina Veronesi, Rita Scarpelli, Stefania Sabella, Mario Caironi   +8 more
wiley   +1 more source

Low envelope fluctuation OFDM waveform design under subcarrier constraints. [PDF]

Sci Rep
Fu M, Jiang D, Jiang K, Gao Y, Han Y.
europepmc   +1 more source