Results 161 to 170 of about 452,384 (268)

Tailoring Functional Properties of Ti–Ni–Cu Shape Memory Alloy Thin Films for MEMS Actuators

Advanced Engineering Materials, EarlyView.
A comprehensive study of critical parameters required to develop well‐performing Ti–Ni–Cu thin film shape memory alloy microactuators is provided. Materials science and device integration aspects are integrated by addressing structural and physical relationships using complementary characterization techniques as well as a practical fabrication solution
Elaheh Akbarnejad, Aleksander Kostka, Gowtham Arivanandhan, Yujiao Li, Alan Savan, Manfred Kohl, Alfred Ludwig   +6 more
wiley   +1 more source

Preparation of HMX/PMMA Composite Microspheres with Excellent Properties by Photoinitiated Emulsion Polymerization. [PDF]

Molecules
Zhang S, Wu N, Jia K, Huang X, Wu X, Hou C, Li H, Wang J.   +7 more
europepmc   +1 more source

High‐Temperature Nanoindentation of Metals: Assessing Thermal Drift, Frame Compliance, and Chemical Composition Effects on the Reported Mechanical Properties

Advanced Engineering Materials, EarlyView.
Do not let thermal drift and instrument artifacts deceive high‐temperature nanoindentation results. We compare classical Oliver–Pharr and automatic image recognition analyses across steels and a Ni alloy to quantify these effects. Accounting for artifacts reveals systematic softening with temperature, while Cr and Ni additions boost resistance ...
Velislava Yonkova, Steffen Brinckmann, Ruth Schwaiger   +2 more
wiley   +1 more source

Engineering Dynamic Electrolyte Microenvironments via Double-Shell Hosts for Practical Lithium-Sulfur Batteries. [PDF]

Nanomicro Lett
Yao Z, Zou Y, Zhang S, Xie W, Li Y, Liu S, Chen X, Zhang K, Zheng C, Sun W.   +9 more
europepmc   +1 more source

Creep Properties and Deformation Mechanism of Additively Manufactured NiAl‐CrMo Composites

Advanced Engineering Materials, EarlyView.
Additively manufactured NiAl‐CrMo composites contain numerous interfaces and cell boundaries that control their creep response. At 700°C under high applied stress, creep is dominated by dislocation‐controlled power‐law mechanisms. At 800°C–900°C and lower stresses, creep is primarily diffusion‐controlled along cell boundaries.
Jan Vollhüter, Andreas Bezold, Johan Westraadt, Katharina Fiegl, Subham Chattoraj, Benjamin Wahlmann, Carolin Körner, Michael Mills, Mathias Göken, Steffen Neumeier   +9 more
wiley   +1 more source

Impact of dual-energy window scatter correction on technetium image quality across different energy windows in cadmium-zinc-telluride-based SPECT/CT. [PDF]

EJNMMI Phys
Zhang R, Wang S, Shen Y, Zheng W, Li N, Wang P, Tan J, Meng Z, Jia Q.   +8 more
europepmc   +1 more source

Recycling of NiTi Shape Memory Alloys: Fundamental and Technological Aspects of a Vacuum Induction Melting Processing Route

Advanced Engineering Materials, EarlyView.
The present study investigates recycling of NiTi shape memory alloys via vacuum induction melting. An ingot was synthesized from elemental Ni and Ti and subjected to three subsequent remelting cycles. Remelting increases process durations and impurity levels and adversely affects microstructures and functional properties.
Sakia Sophia Noorzayee, Son Tung Mai, Sarath Menon, Braulio Gadiel Sánchez Ortega, Ralf Drautz, Alexander Kauffmann, Gunther Eggeler, Jan Frenzel   +7 more
wiley   +1 more source

C-N exchange model of legume-Rhizobium symbiosis incorporating ATP budget constraints and energy-mass balance between the species. [PDF]

PLoS One
Furukawa T, Iimura T.
europepmc   +1 more source

Workflow for Design of Experiments‐Based Modeling of Species Transport and Growth Kinetics in GaN Hydride Vapor Phase Epitaxy

Advanced Engineering Materials, EarlyView.
A novel workflow for investigating hydride vapor phase epitaxy for GaN bulk crystal growth is proposed. It combines Design of experiments (DoE) with physical simulations of mass transport and crystal growth kinetics, serving as an intermediate step between DoE and experiments.
J. Tomkovič, G. Lukin, H. Torkashvand, A. Kerschbaum, M. Müller, S. Besendörfer, J. Heitmann, J. Friedrich   +7 more
wiley   +1 more source

Sub-10-nm imprint lithography on elastomers by chain translocated crystallization in nanochannels. [PDF]

Sci Adv
Yang Y, Ru Y, Qi S, Sun Y, Huang J, Yan Z, Zhao T, Zuo B, Jiang L, Liu M.   +9 more
europepmc   +1 more source