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Influence of Carbon Particle in Polymer Matrix Composite over Mechanical Properties and Tribology Behavior [PDF]
In this research, the carbon particle dispersions are made in two different levels as carbon nano tube (CNT) and carbon particle in microns range.
K. Sravanthi+2 more
doaj +1 more source
Catalytic disconnection of C–O bonds in epoxy resins and composites
Fibre-reinforced epoxy composites are well established in regard to load-bearing applications in the aerospace, automotive and wind power industries, owing to their light weight and high durability.
A. Ahrens+9 more
semanticscholar +1 more source
The rGH@FeNi/epoxy electromagnetic interference (EMI) shielding composites with regular 3D honeycomb structures were prepared by sacrificial template, freeze-drying and vacuum-assisted impregnation of epoxy resin.
Ping Song+4 more
semanticscholar +1 more source
Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications
Epoxy resins are used in various fields in a wide range of applications such as coatings, adhesives, modeling compounds, impregnation materials, high-performance composites, insulating materials, and encapsulating and packaging materials for electronic ...
A. Shundo, Satoru Yamamoto, Keiji Tanaka
semanticscholar +1 more source
Carbon fiber-reinforced epoxy with 100% fiber recycling by transesterification reactions
Carbon fiber (CF)-reinforced epoxy is the most commonly used advanced composite with high performance. However, these composites usually face intractable disposal problems in their lifecycles, due to the stable cross-linked network structures of epoxy ...
Jianqiao Wu+6 more
doaj +1 more source
High‑efficiency electromagnetic interference (EMI) shielding materials are of great importance for electronic equipment reliability, information security and human health.
Wen Wang+5 more
semanticscholar +1 more source
Transport Characteristics of Interfacial Charge in SiC Semiconductor–Epoxy Resin Packaging Materials
The silicon carbide (SiC) wide bandgap (WBG) semiconductor power device has been widely applied for its excellent properties. However, the charge accumulated in the interface of SiC semiconductor-related insulation packaging may lead to serious material ...
Chi Chen+6 more
doaj +1 more source
Effect of Type and Amount of Accelerator on Reactivity and Curing Behavior of Epoxy/Dicyandiamide/Accelerator System [PDF]
Hypothesis: The effects of four accelerators 2,4,6-tris(dimethyl aminomethyl) phenol (DMP30), 2-methylimidazole (2MI), 2-phenylimidazole (2PhI) and carbonyldiimidazole (CDI) at 0.6 and 1 phr contents on the curing behavior of a diglycidyl ether of ...
Maryam Dareh+2 more
doaj +1 more source
In this work, the engineered polyaniline (PANI)/epoxy composites reinforced with PANI-M (physical mixture of PANI spheres and fibers) exhibit significantly enhanced electromagnetic wave absorption performance and mechanical property.
Jiang Guo+11 more
semanticscholar +1 more source
Lightweight and cellular-structured graphene-pyrrole (G-P) aerogels /epoxy composites were prepared basing on the three-step fabrication process which involving infiltration of epoxy resin into G-P aerogels under vacuum atmosphere.
WANG Mu+5 more
doaj +1 more source