Results 11 to 20 of about 718,155 (307)
SusMat, 2023 Epoxy resins with a high dielectric constant and low intrinsic thermal conductivity coefficient cannot meet the current application requirements of advanced electronic and electrical equipment.
Xuerong Fan +3 more
semanticscholar +1 more source
JACS Au, 2023 The low intrinsic thermal conduction and high dielectric properties of epoxy resins have significantly limited their applications in electrical and electronic devices with high integration, high frequency, high power, and miniaturization.
Junliang Zhang +5 more
semanticscholar +1 more source
Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications
JACS Au, 2022 Epoxy resins are used in various fields in a wide range of applications such as coatings, adhesives, modeling compounds, impregnation materials, high-performance composites, insulating materials, and encapsulating and packaging materials for electronic ...
A. Shundo, Satoru Yamamoto, Keiji Tanaka
semanticscholar +1 more source
Nano-Micro Letters, 2022 High‑efficiency electromagnetic interference (EMI) shielding materials are of great importance for electronic equipment reliability, information security and human health.
Wen Wang +5 more
semanticscholar +1 more source
Advanced Composites and Hybrid Materials, 2022 In this work, the engineered polyaniline (PANI)/epoxy composites reinforced with PANI-M (physical mixture of PANI spheres and fibers) exhibit significantly enhanced electromagnetic wave absorption performance and mechanical property.
Jiang Guo +11 more
semanticscholar +1 more source
Natural Fillers as Potential Modifying Agents for Epoxy Composition: A Review
Polymers, 2022 Epoxy resins as important organic matrices, thanks to their chemical structure and the possibility of modification, have unique properties, which contribute to the fact that these materials have been used in many composite industries for many years ...
Natalia Sienkiewicz +2 more
semanticscholar +1 more source
ACS Applied Materials and Interfaces, 2020 The effective dissipation of heat is critical to the performance and longevity of high power electronics, so it is important to prepare highly thermally conductive polymer-based packaging materials for efficient thermal management.
Zhan Liu, Junhui Li, Xiaohe Liu
semanticscholar +1 more source
Hybridization Effect on Mechanical Properties of Basalt/Kevlar/Epoxy Composite Laminates
Polymers, 2022 The present work investigates the fabrication of Kevlar/epoxy and basalt/epoxy and Kevlar/basalt/epoxy hybrid composite laminates and compares their mechanical properties.
Ramesh Velumayil, A. Palanivel
semanticscholar +1 more source
Scientific Reports, 2021 Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field ...
Zhengdong Wang +7 more
semanticscholar +1 more source
Studying of Wear Rate for Ternary Polymer Blends under the Influence of Chemical Solutions [PDF]
Engineering and Technology Journal, 2013 This work has been done with use of Epoxy and Novolac resins mixed with either polyurethane (PUR) or polysulphide(PSR) rubbers to compose ternary polymer blends. Two groups of samples are prepared:1. Blend A (70% Epoxy +15%Novolac+15%PUR).2. Blend B (60%
Ban Ayyoub Yousif, Balkees M. Dhyaa
doaj +1 more source