Results 241 to 250 of about 536,706 (368)

Ultra‐Improved Interfacial Strength Between Metallic Surface and Polyurethane via Cost‐Effective Anodizing Process

open access: yesAdvanced Materials Interfaces, EarlyView.
SAA significantly enhanced Al/PU bonding, increasing SLSS by up to 920% and fracture energy by 15 100% through optimized micro‐nano porous surfaces. RSM identified the optimal anodizing conditions, while ML confirmed sulfuric acid concentration and roughness as dominant predictors of strength.
Umut Bakhbergen   +6 more
wiley   +1 more source

Hydrophobic Properties of Pine Wood Coatings Based on Epoxy Varnish and (Fluoro)Alkyl Methacrylate Copolymers. [PDF]

open access: yesPolymers (Basel)
Klimov VV   +5 more
europepmc   +1 more source

Stabilizing Oxygen Vacancies in Plasmonic WO3‐x Semiconductor Nanosheets via Surface Reconstruction Approach

open access: yesAdvanced Materials Interfaces, EarlyView.
This study reports a surface reconstruction strategy to stabilize oxygen vacancies in plasmonic WO3‐x nanosheets. By engineering a dense WO3 passivation layer, the authors effectively trap interior vacancies against environmental reoxidation. This architecture preserves strong localized surface plasmon resonance effects, resulting in significantly ...
Yuge Feng   +7 more
wiley   +1 more source

Soft Electromagnetic Actuator and Oscillator

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
This work presents a groundbreaking soft electromagnetic system capable of bistable actuation and self‐regulated oscillation. Using liquid metal and silicone as a compliant conductor, the actuator enables force generation, sensing, and feedback with minimal power.
Noah D. Kohls, Yi Chen Mazumdar
wiley   +1 more source

Low-Flammability Hybrid Polymer Materials Based on Epoxy Oligomers and In Situ-Synthesized Zinc-Containing Microparticles. [PDF]

open access: yesPolymers (Basel)
Borisov SV   +7 more
europepmc   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

Swelling behavior of nanoporous epoxy-amine gels

open access: gold, 2006
Kaustubh A. Ghorpade   +2 more
openalex   +1 more source

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