Preparation of Highly Uniform Silica Microspheres Recycled from Silicone Rubber and Their Application as Fillers in Epoxy Resin-Based Insulating Materials. [PDF]
Chen Z, Cheng L, Xu W, Liao R.
europepmc +1 more source
SAA significantly enhanced Al/PU bonding, increasing SLSS by up to 920% and fracture energy by 15 100% through optimized micro‐nano porous surfaces. RSM identified the optimal anodizing conditions, while ML confirmed sulfuric acid concentration and roughness as dominant predictors of strength.
Umut Bakhbergen +6 more
wiley +1 more source
Hydrophobic Properties of Pine Wood Coatings Based on Epoxy Varnish and (Fluoro)Alkyl Methacrylate Copolymers. [PDF]
Klimov VV +5 more
europepmc +1 more source
This study reports a surface reconstruction strategy to stabilize oxygen vacancies in plasmonic WO3‐x nanosheets. By engineering a dense WO3 passivation layer, the authors effectively trap interior vacancies against environmental reoxidation. This architecture preserves strong localized surface plasmon resonance effects, resulting in significantly ...
Yuge Feng +7 more
wiley +1 more source
Damping properties of bamboo and glass fiber reinforced epoxy hybrid composites with edge cracks for vibration damping applications. [PDF]
Adimass SA.
europepmc +1 more source
Soft Electromagnetic Actuator and Oscillator
This work presents a groundbreaking soft electromagnetic system capable of bistable actuation and self‐regulated oscillation. Using liquid metal and silicone as a compliant conductor, the actuator enables force generation, sensing, and feedback with minimal power.
Noah D. Kohls, Yi Chen Mazumdar
wiley +1 more source
Low-Flammability Hybrid Polymer Materials Based on Epoxy Oligomers and In Situ-Synthesized Zinc-Containing Microparticles. [PDF]
Borisov SV +7 more
europepmc +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
Relationship Between Hardness and Impact Strength of Epoxy-Glass Composites Modified with Carbonisate from MDF Pyrolysis. [PDF]
Wieczorska A, Drewing S.
europepmc +1 more source
Swelling behavior of nanoporous epoxy-amine gels
Kaustubh A. Ghorpade +2 more
openalex +1 more source

