Results 291 to 300 of about 200,592 (346)

Depth‐Customizable 3D Electrode Array for Recording Functional Connectivity in the Brain

Advanced Electronic Materials, EarlyView.
In this study, a depth‐adjustable, flexible 3D multi‐shank electrode array that produces precise neural recordings at various brain depths is developed. Integrating 2D flexible electrode arrays with a modular supporting board allowed the insertion depth to be easily adjusted without re‐fabrication.
Minseok Kim, Sehwan Park, Haeyun Lee, Jimin Lee, Namsun Chou, Hyogeun Shin   +5 more
wiley   +1 more source

Comparison of Epoxy Resin and Rigid Polyurethane Foam as a Bone Substitute to Study Implant Biomechanics. [PDF]

Cureus
Bano NZ, Shaukat A.
europepmc   +1 more source

A study of scaler sharpening - The effect of the cutting edge of scaler and the epoxy resin surface with sereral types of sharpening stones and strokes.

, 1989
Jun-ichi Otogoto
openalex   +2 more sources

Breaking Barriers: Centimeter‐Sized Single Layer WSe2 by Gold‐Mediated Exfoliation for Ambipolar Field Effect Transistors at Ultra‐Low Voltages

Advanced Electronic Materials, EarlyView.
2D transition metal dichalcogenides (TMDCs) are promising for next‐gen electronics. In this work, centimetrer‐sized single‐layer WSe2 is achieved via thermally activated gold‐mediated exfoliation. When integrated into solid‐state electrolyte gating field‐effect transistors, the devices exhibit ambipolar behavior, steep subthreshold swings down to 30 mV 
Sarah Grützmacher, Wenkai Liu, Max Heyl, Patrick Amsalem, Norbert Koch, Emil J. W. List‐Kratochvil, Giovanni Ligorio   +6 more
wiley   +1 more source

Novel Recycling of Epoxy Thermosets by Blending with Reversible Diels-Alder Epoxy Resin. [PDF]

Polymers (Basel)
Lorero I, Rico B, Campo M, Prolongo SG.
europepmc   +1 more source

Effect of Added Ni Nanoparticles on the Microstructure and Mechanical Properties of Sn58Bi/Cu Solder Joints under Thermal Shock Conditions

Advanced Electronic Materials, EarlyView.
This article concludes that the microstructure as well as grain coarsening is suppressed and the growth of IMC layer is promoted in Sn58Bi/Cu solder joints versus Sn58Bi‐0.6 Ni/Cu solder joints after 1200 thermal shock experiments, while the mechanical properties of the solder joints are improved.
Jiamin Zhang, Liang Zhang, Yuhao Chen, Weimin Long, Yunxin Liu   +4 more
wiley   +1 more source

Surface Chemistry and Molecular Dynamics of Epoxy Resin: Insights from Analysis During Curing and Post-Curing Processes. [PDF]

Polymers (Basel)
Tofanica BM, Ungureanu E, Awaja F.
europepmc   +1 more source

In Situ Generated Silver Nanoparticles on Boron Nitride Nanosheets Followed by Silane Modification in High‐Performance Epoxy Nanocomposites for Advanced Packaging Applications

Advanced Electronic Materials, EarlyView.
 . Abstract The increasing power density and miniaturization of modern electronic devices have underscored the critical need for efficient thermal management solutions. Boron nitride nanosheets (BNNS) have emerged as promising fillers for thermally conductive epoxy based composite.
Zihao Lin, Alexandar King, Xueyu Hu, Wenbin Fu, Deven S. Shah, Kyoung‐Sik Moon, Wen‐Hsi Lee, Ching‐Ping Wong   +7 more
wiley   +1 more source

Molecular Level Understanding of Amine Structural Variations on Diaminodiphenyl Sulfone to Thermomechanical Characteristics in Bifunctional Epoxy Resin: Molecular Dynamics Simulation Approach. [PDF]

Polymers (Basel)
Jeong HJ, Kwon SH, Lim J, Kwon W, Park GH, Lee E, Won JS, Lee MY, Jeong E, Lee SG.   +9 more
europepmc   +1 more source

Advances in MXene‐Based Electronics via Surface and Structural Redesigning and Beyond

Advanced Electronic Materials, EarlyView.
Herein, various MXenes surface and structural engineering strategies such as termination control, doping, interlayer design, and heterostructures are reviewed for advanced electronics applications. We discuss how these approaches optimize conductivity, work function, and device integration, enabling breakthroughs in transistors, photodetectors, and ...
Adnan Younis, Edvin Idrisov, Saleh Thaker, Fathalla Hamed, El Hadi Sadki, Muhammad Zafar Iqbal, Tariq Mahmood, Babar Shabbir, Qiaoliang Bao   +8 more
wiley   +1 more source