Results 311 to 320 of about 200,592 (346)
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Bisphenol-A epoxy resin reinforced and toughened by hyperbranched epoxy resin
Frontiers of Chemical Engineering in China, 2007The study on toughening and reinforcing of bisphenol-A epoxy resin is one of important developmental direction in the field. This paper reports a one-pot synthesis of aromatic polyester hyperbranched epoxy resin HTDE-2, an effect of HTDE-2 content on the mechanical and thermal performance of the bisphenol-A (E51)/HTDE-2 hybrid resin in detail.
Zhang Daohong, Jia De-min, Huang Xianbo
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Chromatography of Epoxy Resins
Journal of Macromolecular Science, Part C, 1984Abstract This review covers the literature in the field of chromatographic analysis of epoxy resins and epoxy resin formulations from about 1970 to the present. Although exhaustive reviews of general chromatographic techniques have recently been published [1–9], and size exclusion chromatography has received additional coverage in journals and ...
S. A. Mestan, C. E. M. Morris
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2005
Publisher Summary Epoxy resins are formed from an oligomer containing at least two epoxide groups and a curing agent, usually either an amine compound or a diacid compound. Epichlorohydrin is the monomer used for the synthesis of glycidyl ethers and glycidyl esters.
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Publisher Summary Epoxy resins are formed from an oligomer containing at least two epoxide groups and a curing agent, usually either an amine compound or a diacid compound. Epichlorohydrin is the monomer used for the synthesis of glycidyl ethers and glycidyl esters.
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1978 IEEE International Conference on Electrical Insulation, 1978
Epoxy resin has been widely used as the insulating materials of various electrical apparatuses due to its' excellent mechanical and electrical properties.
Shoji Hirabayashi+3 more
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Epoxy resin has been widely used as the insulating materials of various electrical apparatuses due to its' excellent mechanical and electrical properties.
Shoji Hirabayashi+3 more
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1995
Publisher Summary This chapter focuses on a study that was conducted to test for bond strength on a representative matrix of commonly used plastics and the adhesives best suited to them. The study concentrates on epoxy resin. The block-shear (ASTM D 4501) test was chosen as the test method because it places the load on a thicker section of the test ...
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Publisher Summary This chapter focuses on a study that was conducted to test for bond strength on a representative matrix of commonly used plastics and the adhesives best suited to them. The study concentrates on epoxy resin. The block-shear (ASTM D 4501) test was chosen as the test method because it places the load on a thicker section of the test ...
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Journal of Applied Polymer Science, 1995
AbstractTransparent, X‐ray contrast (radiopaque) epoxy resins were obtained by dissolving up to 25 wt % triphenylbismuth in the commercial epoxy resin prepolymers EPON‐815, DER‐330, DER‐383, and DEN‐431 which were then hardened with diethylenetriamine.
Israel Cabasso+2 more
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AbstractTransparent, X‐ray contrast (radiopaque) epoxy resins were obtained by dissolving up to 25 wt % triphenylbismuth in the commercial epoxy resin prepolymers EPON‐815, DER‐330, DER‐383, and DEN‐431 which were then hardened with diethylenetriamine.
Israel Cabasso+2 more
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Journal of Applied Polymer Science, 1993
AbstractThe curing behavior of epoxy resins prepared by reacting epichlorohydrin with 4,4′‐diaminodiphenyl methane (DADPM)/4,4′‐diaminodiphenyl ether (DADPE) or 4,4′‐diaminodiphenyl sulfone (DDS) was investigated using DDS and tris‐(m‐aminophenyl)phosphine oxide (TAP) as curing agents.
I. K. Varma+2 more
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AbstractThe curing behavior of epoxy resins prepared by reacting epichlorohydrin with 4,4′‐diaminodiphenyl methane (DADPM)/4,4′‐diaminodiphenyl ether (DADPE) or 4,4′‐diaminodiphenyl sulfone (DDS) was investigated using DDS and tris‐(m‐aminophenyl)phosphine oxide (TAP) as curing agents.
I. K. Varma+2 more
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An investigation of epoxy resin dies
The Journal of Prosthetic Dentistry, 19801. Complete crown epoxy resin dies are undersized. 2. MOD onlay epoxy resin dies are accurate. 3. Detail duplication of epoxy resin dies is comparable to that of die stone. 4. Hardness values of epoxy resin are generally less than those of die stone. The hardness of Epoxydent closely approached that of die stone.
Gerald T. Nomura+2 more
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SPIE Proceedings, 2006
We observed that a commercial epoxy resin (Comex (R) is enable to record images by means of lithography techniques. We can generate a hologram using a digital image and a computer simulation program and transferred it on our resin by microlithography techniques to get a phase hologram and increase its efficiency.
E. L. Ponce-Lee+7 more
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We observed that a commercial epoxy resin (Comex (R) is enable to record images by means of lithography techniques. We can generate a hologram using a digital image and a computer simulation program and transferred it on our resin by microlithography techniques to get a phase hologram and increase its efficiency.
E. L. Ponce-Lee+7 more
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1989
Epoxy resins comprise a group of crosslinkable materials, which all possess the same type of reactive functional group, the epoxy or oxirane group (1); their chemistry and technology have been reported in a number of texts.1 ...
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Epoxy resins comprise a group of crosslinkable materials, which all possess the same type of reactive functional group, the epoxy or oxirane group (1); their chemistry and technology have been reported in a number of texts.1 ...
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