Results 51 to 60 of about 1,066,022 (300)

The Role of Ultra‐Thin Passive Films and Organic Adsorbates on Aluminum Chips for a Friction‐Induced Solid‐State Recycling Process

open access: yesAdvanced Engineering Materials, EarlyView.
Despite benefits to storage stability and handleability of aluminum scrap, octadecyl phosphonic acid (ODPA) SAMs reduce the tensile strength of wires produced using friction‐induced recycling. Etching and methyl diphosphonic acid (MDPA) coatings, however, have little effect.
Timothy D. Goller   +3 more
wiley   +1 more source

A global wire planning scheme for Network-on-Chip. [PDF]

open access: yes, 2003
As technology scales down, the interconnect for on-chip global communication becomes the delay bottleneck. In order to provide well-controlled global wire delay and efficient global communication, a packet switched Network-on-Chip (NoC) architecture was ...
Tenhunen, Hannu   +3 more
core   +4 more sources

Fundamental Investigations to Evaluate the Influence of Notching Processes on a Subsequent Cyclic Bending Process for the Production of Wire Cores

open access: yesJournal of Manufacturing and Materials Processing, 2023
The production of wire cores by notch rolling and cyclic bending promises an ecologically and economically efficient manufacturing option for steel fibers. The paper at hand evaluates the influence of wire strips on cyclic bending by applying rolled wire
Alina Biallas   +2 more
doaj   +1 more source

Performance evaluation of a new taut wire system for straightness measurement of machine tools [PDF]

open access: yes, 2014
This paper describes evaluation of a method of measuring the straightness of motion of machine tool axes using a taut wire and an optical sensor head mounted at the tool point location. In contrast to commonly used taut wire instruments, straightedges or
Longstaff, Andrew P.   +4 more
core   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

open access: yesAdvanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone   +11 more
wiley   +1 more source

Comparison of The Clinical and Radiological Outcomes Between Kirschner Wires and Herbert Screw Fixation of Nonunited Scaphoid Fractures in Adult Population: A Randomized Controlled Study

open access: yesArcades of Medicine
Background: Scaphoid nonunion presents a surgical challenge due to precarious retrograde blood supply. This study compared clinical and radiological outcomes of Kirschner wire (K-wire) versus Herbert screw fixation in an adult population.
Emad Abdelati   +3 more
doaj   +1 more source

Cable Crosstalk Suppression with Two-Wire Voltage Feedback Method for Resistive Sensor Array

open access: yesSensors, 2016
Using a long, flexible test cable connected with a one-wire voltage feedback circuit, a resistive tactile sensor in a shared row-column fashion exhibited flexibility in robotic operations but suffered from crosstalk caused by the connected cable due to ...
Jianfeng Wu   +3 more
doaj   +1 more source

Laser‐Induced Graphene from Waste Almond Shells

open access: yesAdvanced Functional Materials, EarlyView.
Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova   +9 more
wiley   +1 more source

Rural Electrification Using Shield Wire Schemes

open access: yes, 2017
Shield wire systems running along existing high-voltage transmission lines can supply household electricity to communities located within 20 km of the high-voltage corridor. At a fraction of the cost of new
Lemondzhava, Tatia   +2 more
core   +1 more source

Redundant Dissimilar Sensor Fusion with Dynamic Driver Input Classification and Graceful Degradation for Drive-by-Wire Applications [PDF]

open access: yes, 2010
Dissimilar sensor redundancy with force and displacement measurements can provide extended fault coverage for drive-by-wire applications. However, large variances occur when correlating these inputs in dynamic measurements.
Sturm, Stefan   +5 more
core   +1 more source

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