Results 171 to 180 of about 18,901 (244)

Influential Factors on Diffusion Bonding Strength as Demonstrated by Bonded Multi-Layered Stainless Steel 316L and 430 Stack. [PDF]

Materials (Basel)
Liu DW, Lin CN, Lin WS, Lee S, Gwo J.
europepmc   +1 more source

NiTi-Cu Bimetallic Structure Fabrication through Wire Arc Additive Manufacturing. [PDF]

Materials (Basel)
Singh S, Demidova E, Resnina N, Belyaev S, Iyamperumal PA, Paul CP, Prashanth KG.   +6 more
europepmc   +1 more source

Enhanced Mechanical Properties of Ti/Mg Laminated Composites Using a Differential Temperature Rolling Process under a Protective Atmosphere. [PDF]

Materials (Basel)
Qi Z, Jia Z, Wen X, Xiao H, Liu X, Gu D, Chen B, Jiang X.   +7 more
europepmc   +1 more source

Permeability scaling relationships of volcanic tuff from core to field scale measurements. [PDF]

Sci Rep
Lucero DD, Bourret SM, Ortiz JP, Fritz BG, Bodmer MA, Heath JE, Kuhlman KL, Boukhalfa H, Otto S, Ezzedine S, Roberts BL, Choens RC, Person MA, Stauffer PH, PE1 Experimental Team.   +14 more
europepmc   +1 more source

Interfacial energy conversion mechanism between 3003 aluminum alloy and 321 stainless steel in vaporizing foil actuator welding process. [PDF]

Sci Rep
Su S, Duan W, Wu Y, Shao F, Sun T, Gu X, Liu X, Wang R.   +7 more
europepmc   +1 more source

Effect of laser beam incidence angle on weld formation mechanism and corrosion resistance of T2 copper/304 stainless steel. [PDF]

Sci Rep
Wang Y, Liu W, Cui H, Lu G.
europepmc   +1 more source

New explosive welding techniques

, 2013
Lotous, V., Dragobetskii, V.
openaire   +1 more source

Extrinsic-Riveting Friction Stir Lap Welding of Al/Steel Dissimilar Materials. [PDF]

Materials (Basel)
Meng X, Gao J, Xie Y, Huang T, Dong J, Ma X, Wang N, Huang Y.   +7 more
europepmc   +1 more source

Application of machine learning and neural network models based on experimental evaluation of dissimilar resistance spot-welded joints between grade 2 titanium alloy and AISI 304 stainless steel. [PDF]

Heliyon
Mezher MT, Pereira A, Shakir RA, Trzepieciński T.   +3 more
europepmc   +1 more source

Wafer-level self-packaged MEMS infrared emitters with high-emissivity black silicon surface. [PDF]

Microsyst Nanoeng
Li Z, Zu H, Chen H, Liu M, San H, Yu D.
europepmc   +1 more source