Crystals, 2023 The combined use of Through Silicon Via (TSV) and metal lines, referred to as TSV-metal lines, is an essential structure in three-dimensional integrated circuits. In-depth research into the electromigration failure mechanism of TSV and the microstructure
Tao Gong +7 more
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Bio-Environment-Induced Degradation and Failure of Internal Fixation Implants
Journal of Functional Biomaterials, 2015 Internal fixations provide fast healing but their failure remains problematic to patients. Here, we report an experimental study in failure of three typical cases of metals: a bent intramedullary stainless steel nail, a broken exterior pure Ti plate, and
Yan Zhou +4 more
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Experimental and Numerical Investigations into the Failure Mechanisms of TRIP700 Steel Sheets
Metals, 2018 The formability and failure behavior of transformation-induced plasticity (TRIP) steel blanks were investigated through various stress states. The forming limit diagram (FLD) at fracture was constructed both experimentally and numerically.
Niloufar Habibi +3 more
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Experimental investigation of sandwich panels supported by thin-walled beams under various load arrangements and number of connectors [PDF]
Archives of Civil Engineering, 2022 In the paper there the laboratory tests of interaction between thin-walled beams of the Z crosssection and the sandwich panels with PIR foam core are presented.
Katarzyna Ciesielczyk +1 more
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Accelerated Life Test for Reliability Evaluation of Pneumatic Cylinders
IEEE Access, 2018 Pneumatic cylinders are intended to be designed for high reliability and long lifetimes. Evaluating such designs through conventional life tests is difficult as the affordable test time is too short to generate a meaningful amount of failure data.
Juan Chen +4 more
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Advanced Science, 2023 Monitoring and diagnosing the battery status in real‐time are of utmost importance for clarifying failure mechanism, improving battery performance, and ensuring safety, particularly under fast charging conditions.
Kyobin Park +11 more
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Nanomechanical Properties and Failure Mechanisms of Two-Dimensional Metal-Organic Framework Nanosheets [PDF]
, 2020 Nanoscale mechanical properties measurement of porous nanosheets presents many challenges. Herein we show atomic force microscope (AFM) nanoindentation to probe the nanoscale mechanical properties of a 2‑D metal‑organic framework (MOF) nanosheet material,
Zhixin, Zeng +5 more
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An investigation of the failure mechanisms of thermoplastic composites at various rates of strain and temperatures [PDF]
, 2003 Includes bibliographical references .The focus of this project is on the deformation behaviour of thermoplastic composites. The materials used were polypropylene and polyamide resins with glass fibres and talc as fillers. These materials were provided by
Netangaheni, Phumudzo T
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Short-Circuit Performance Analysis of Commercial 1.7 kV SiC MOSFETs Under Varying Electrical Stress
MicromachinesThe short-circuit (SC) robustness of SiC MOSFETs is critical for high-power applications, yet 1.2 kV devices often struggle to meet the industry-standard SC withstand time (SCWT) under practical operating conditions.
Shahid Makhdoom +6 more
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MOCA ARM: Analog Reliability Measurement based on Monte Carlo Analysis [PDF]
Journal of Electrical and Computer Engineering Innovations, 2016 Due to the expected increase of defects in circuits based on deep submicron technologies, reliability has become an important design criterion. Although different approaches have been developed to estimate reliability in digital circuits and some ...
S. Taghipour, R. Niaraki Asli
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