Results 51 to 60 of about 6,005 (217)
Femtosecond laser machining of multi-depth microchannel networks onto silicon [PDF]
Direct writing of multi-depth microchannel branching networks into a silicon wafer with femtosecond pulses at 200 kHz is reported. The silicon wafer with the microchannels is used as the mold for rapid prototyping of microchannels on polydimethylsiloxane.
Kam, D H, Mazumder, Jyoti, Shah, L
core +1 more source
A mask‐free and cost‐effective UV‐pico‐second laser‐based microfabrication method is proposed to fabricate large‐area biodegradable microelectrode arrays and pressure sensors. These devices demonstrate low impedance, good conformability, excellent biocompatibility, and rapid degradation, providing a new route for next‐generation transient electronics ...
Bhavani Prasad Yalagala +5 more
wiley +1 more source
Copper (Cu) is the main interconnect conductor for integrated circuits (IC), and its processing quality is very important to device performance. Herein, a hybrid process of plasma oxidation and femtosecond laser (fs-laser) ablation was proposed for the ...
Shuai Wang +9 more
doaj +1 more source
Direct Laser Writing of Magnetic Micro Actuators With a Stimulus‐Responsive Compliant Hinge
This study presents a versatile modular design strategy for adaptive 3D microactuators. Using two‐photon‐induced C,H insertion reactions within solid polymer layers, chemically distinct hinge and stimulus responsive materials are patterned in one step. The hinge's properties enable tunable motion, mechanical control, and reconfigurable actuation across
Eleonora Galli +4 more
wiley +1 more source
An Experimental Study of Multiphoton Ionization in Fused Silica at IR and Visible Wavelengths
We present the results of an experimental study of multiphoton ionization in fused silica, using a linearly polarized femtosecond Satsuma fiber laser with an active medium based on Yb+3 ions, at 515 -nm and 1030 -nm wavelengths.
Anna Bogatskaya +5 more
doaj +1 more source
Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared [PDF]
Citation: Grojo, D., Mouskeftaras, A., Delaporte, P., & Lei, S. T. (2015). Limitations to laser machining of silicon using femtosecond micro-Bessel beams in the infrared. Journal of Applied Physics, 117(15), 7.
Alexandros Mouskeftaras +4 more
core +3 more sources
Possibilities for ablation‐free microforming of borosilicate glass using ultrashort laser pulses are presented. Depending on the laser parameters and scanning strategy, surface structures with profile heights of up to 20 µm could be produced. The work provides a comprehensive experimental and analytical characterization of the microforming process ...
Marina Skiba +5 more
wiley +1 more source
This review examines the evolution of bioprinting toward minimally invasive in situ strategies for internal organ regeneration. It defines the technological roadmap from handheld systems to advanced minimally invasive bioprinting platforms, positioning soft robotics as a core enabler.
Duc Tu Vu +9 more
wiley +1 more source
Dispersion engineering of microresonators is very important for applications, such as optical comb generation which desires wideband flat and small dispersion. In this paper, dispersion investigation has been carried out for whispering gallery mode (WGM)
Cheng Zhou, Jiangbing Du, Zuyuan He
doaj +1 more source
Nanoindentation studies on waveguides inscribed in chalcogenide glasses using ultrafast laser [PDF]
Optical straight waveguides are inscribed in GeGaS and GeGaSSb glasses using a high repetition-rate sub-picosecond laser. The mechanical properties of the glasses in the inscribed regions, which have undergone photo induced changes, have been evaluated ...
Asokan, Sundarrajan +5 more
core +1 more source

